IMC growth behavior along c-axis of Sn grain under current stressing

Wang, Yan; Wang, Yishu; Ma, Limin; Han, Jing; Guo, Fu

doi:10.1007/s10854-018-9442-0

Cited by 5 publications

(2 citation statements)

References 21 publications

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“…Meanwhile, the atomic flux deviation from the c-axis is very limited, and the UBM dissolution and IMC formation seldom occur along the c-axis. Similar results in the solder joints with Cu UBMs were also observed in [ 72 , 73 , 74 ]. Moreover, in the Sn-Pb solder microbump, when the electromigration test was carried out at −196 °C, the anisotropic migration of the Pb did not occur.…”

Section: Effect Of Sn Grain Orientation On Electromigrationsupporting

confidence: 87%

Effect of Sn Grain Orientation on Reliability Issues of Sn-Rich Solder Joints

Shen

2022

Materials

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Sn-rich solder joints in three-dimensional integrated circuits and their reliability issues, such as the electromigration (EM), thermomigration (TM), and thermomechanical fatigue (TMF), have drawn attention related to their use in electronic packaging. The Sn grain orientation is recognized as playing an important role in reliability issues due to its anisotropic diffusivity, mechanical properties, and coefficient of thermal expansion. This study reviews the effects of the Sn grain orientation on the EM, TM, and TMF in Sn-rich solder joints. The findings indicate that in spite of the failure modes dominated by the Sn grain orientation, the size and shape of the solder joint, as well as the Sn microstructures, such as the cycling twining boundary (CTB), single crystals, and misorientations of the Sn grain boundary, should be considered in more detail. In addition, we show that two methods, involving a strong magnetic field and seed crystal layers, can control the Sn grain orientations during the solidification of Sn-rich solder joints.

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Section: Effect Of Sn Grain Orientation On Electromigrationsupporting

confidence: 87%

Effect of Sn Grain Orientation on Reliability Issues of Sn-Rich Solder Joints

Shen

2022

Materials

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“…In particular, many studies have focused on nanowires made of III-V semiconductors because the band gap energy in these materials can be controlled by alloy composition [5,6]. One challenge in growing multicomponent heterostructures, such as InGaAs, AlGaAs, and GaAsSb, is that these alloys have a miscibility gap in their phase diagrams and therefore at equilibrium these alloys phase separate [7]. During growth process, phase separation can be kinetically inhibited for most III-V semiconductors because of the relatively low growth temperatures.…”

Section: Introductionmentioning

confidence: 99%

Control of surface induced phase separation in immiscible semiconductor alloy core-shell nanowires

Arjmand

Szlufarska

2017

Computational Materials Science

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Semiconductor nanowires have been shown to exhibit novel optoelectronic properties with respect to bulk specimens made of the same material. However, if a semiconductor alloy has a miscibility gap in its phase diagram, at equilibrium it will phase separate, leading to deterioration of the aforementioned properties. One way to prevent this separation is to grow the material at low temperatures and therefore to suppress kinetics. Such growth often needs to be followed by high-temperature annealing in order to rid the system of undesirable growth-induced defects. In this study, we propose a method to control phase separation in core-shell nanowires during high temperature annealing by tailoring geometry and strain. Using a phase field model we determined that phase separation in nanowires begins at the free surface and propagates into the bulk. We discovered that including a thin shell around the core delays the phase separation whereas a thick shell suppresses the separation almost entirely.

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Anisotropy-induced reliability issues and grain orientation control in Sn-based micro solder joints for advanced packaging

Qiao,

Zhao

2024

Journal of Materials Science & Technology

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IMC growth behavior along c-axis of Sn grain under current stressing

Cited by 5 publications

References 21 publications

Effect of Sn Grain Orientation on Reliability Issues of Sn-Rich Solder Joints

Effect of Sn Grain Orientation on Reliability Issues of Sn-Rich Solder Joints

Control of surface induced phase separation in immiscible semiconductor alloy core-shell nanowires

Anisotropy-induced reliability issues and grain orientation control in Sn-based micro solder joints for advanced packaging

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