Fifteenth International Symposium on Quality Electronic Design 2014
DOI: 10.1109/isqed.2014.6783303
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Impact of adaptive proactive reconfiguration technique on Vmin and lifetime of SRAM caches

Abstract: This work presents a test and measurement technique to monitor aging and process variation status of SRAM cells as an aging-aware design technique. We have then verified our technique with an implemented chip. The obtained aging information are utilized to guide our proactive strategies, and to track the impact of aging in new reconfiguration techniques for cache memory structures. Our proactive techniques improve the reliability, extend the SRAMs lifetime, and reduce the Vmin drift in presence of process vari… Show more

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Cited by 5 publications
(4 citation statements)
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“…All of the results Chapter has been published in Conference papers of VLSI Test Symposium (VTS 2012) [88], International Conference Mixed Design of Integrated Circuits and Systems (MIXDES 2012) [95], Design Automation Test Europe (DATE 2013) [96], International Symposium on Quality Electronic Design (ISQED 2014) [97] and Journal paper of IEEE Transaction on VLSI (TVLSI 2015) [98].…”
Section: Discussionmentioning
confidence: 99%
See 1 more Smart Citation
“…All of the results Chapter has been published in Conference papers of VLSI Test Symposium (VTS 2012) [88], International Conference Mixed Design of Integrated Circuits and Systems (MIXDES 2012) [95], Design Automation Test Europe (DATE 2013) [96], International Symposium on Quality Electronic Design (ISQED 2014) [97] and Journal paper of IEEE Transaction on VLSI (TVLSI 2015) [98].…”
Section: Discussionmentioning
confidence: 99%
“…All of the results Chapter has been published in Conference papers of Design Automation Test Europe (DATE 2013) [96], International Symposium on Quality Electronic Design (ISQED 2014) [97] and Journal paper of IEEE Transaction on VLSI (TVLSI 2015) [98].…”
Section: Reliability-aware Memory Design Using Advanced Reconfigurati...mentioning
confidence: 99%
“…Before the die is fabricated and packaged, we can identify parametric mitigation techniques in two complementary domains: either design related or related to process technology. With respect to the various design stages, which finally lead to the tape-out, parametric mitigation can be applied either by optimizing the existing design (without adding new features) [126,10,286] or by enhancing the design with additional capabilities for parametric reliability [284,209]. In the category of process technology, we include all mitigation techniques that are employed during the processing of the wafer so that the target design can be taped out with minimal parametric violations.…”
Section: Single Diementioning
confidence: 99%
“…Pre-Fab Design Related Design Optimization [126,10], [286] Capability Addition [209,284] Process Technology Materials [82,266] Lithography [286], [205,285] Post-Fab Before Market Non-Intrusive [238,153,165] Intrusive [80,206,70] After Market Reactive [291,216], [180] Chapters 5 and 6…”
Section: Single Diementioning
confidence: 99%