Impact of an Elevated Temperature Environment on Sn-Ag-Cu Interconnect Board Level High-G Mechanical Shock Performance

Lee, Tae‐Kyu; Chen, Zhiqiang; Baty, Greg; Bieler, T. R.; Kim, Choong Un

doi:10.1007/s11664-016-4902-x

Cited by 5 publications

(2 citation statements)

References 12 publications

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“…Further exploration into solder joint behaviour is provided by a study on Sn58Bi solder, which reveals the length-dependent electromigration behaviour and identifies a critical length for electromigration, thus contributing to understanding failure mechanisms in these materials [94]. Additionally, the performance of Sn-Ag-Cu interconnects under high-G mechanical shock at elevated temperatures is examined, offering insights into how these conditions affect joint integrity and reliability [95]. A comparative study on Sn-Ag-Cu solder joints with ENIG and ENEPIG finishes under extreme temperature thermal shock adds another layer of understanding by contrasting the effects of different finishes on joint performance under severe thermal conditions [96].…”

Section: Discussionmentioning

confidence: 99%

Comparative Analysis of SAC Solder Alloys for Enhanced Reliability in Electronic Assemblies: A Finite Element Approach

Depiver,

Mallik,

Amalu

2024

Preprint

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In an era where environmental sustainability and electronic reliability are paramount, this study provides a critical quantitative analysis of lead-free Sn-Ag-Cu (SAC) solder joints, employing Finite Element Analysis (FEA) to scrutinise their thermomechanical fatigue and creep deformation characteristics. The investigation juxtaposes four SAC solder alloys (SAC305, SAC387, SAC396, and SAC405) against traditional lead-based Sn63Pb37 solder to elucidate their microstructural evolution and ensure long-term reliability. FEA simulations disclose that SAC387 alloy exhibits the highest yield stress at 58 MPa, whereas SAC405 shows remarkable resilience with the lowest stress accumulation, characterised by σ = 1.543T – 34.983. Isothermal ageing studies demonstrate SAC387’s accelerated creep response, indicating a higher susceptibility to failure. Conversely, SAC405's steadfast nature under isothermal ageing is marked by the least strain and deformation rates, enhancing its reliability. Strain distribution analyses further reveal that SAC405 alloys endure the lowest strain levels, contrasting with SAC387, which experiences substantial deformation and leads to strain energy density—a key longevity indicator. Thus, SAC405 and Sn63Pb37 record the lowest strain energy densities, highlighting their robustness. These findings provide a comprehensive assessment of SAC solder alloys, focusing on their stress, strain, energy density, and strain rates. The reliance on FEA for predictive analysis indicates the potential for pre-empting failure, offering a valuable framework for electronic manufacturers in selecting and optimising solder materials. This study illuminates the intricate dynamics of SAC solder joints under thermomechanical stress, serving as an indispensable resource for designing robust and sustainable electronics that align with the industry’s environmental responsibilities.

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Section: Discussionmentioning

confidence: 99%

Comparative Analysis of SAC Solder Alloys for Enhanced Reliability in Electronic Assemblies: A Finite Element Approach

Depiver,

Mallik,

Amalu

2024

Preprint

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“…Copper is a typical face-centered cubic (fcc) metal with a wide range of applications due to its reliability, low resistivity, and high thermal and electrical conductivity [1][2][3]. It is often used at elevated temperatures or in high-stress conditions [4][5][6]. Voids are commonly formed in fcc metals under high-stress conditions [7][8][9] leading to severe degradation effects [2].…”

Section: Introductionmentioning

confidence: 99%

Structure and Migration Mechanisms of Small Vacancy Clusters in Cu: A Combined EAM and DFT Study

Fotopoulos¹,

Mora‐Fonz²,

Kleinbichler³

et al. 2023

Preprint

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Voids in face-centered cubic (fcc) metals are commonly assumed to form by the aggregation of vacancies; however, the mechanisms of vacancy clustering and diffusion are not fully understood. In this study, we use computational modeling to provide a detailed insight into the structures and formation energies of primary vacancy clusters, mechanisms and barriers for their migration in bulk copper, and how these properties are affected at simple grain boundaries. The calculations were carried out using Embedded Atom Method (EAM) potentials and Density Functional Theory (DFT) and employed the Site-Occupation Disorder code (SOD), the Activation Relaxation Technique nouveau (ARTn) and the Knowledge Led Master Code (KLMC). We investigate stable structures and migration paths and barriers for clusters of up to six vacancies. Migration of vacancy clusters occurs via hops of individual constituent vacancies with di-vacancies having a significantly smaller migration barrier than mono-vacancies and other clusters. This barrier is further reduced when di-vacancies interact with grain boundaries. This interaction leads to the formation of self-interstitial atoms and introduces significant changes into the boundary structure. Tetra-, penta-, and hexa-vacancy clusters exhibit increasingly complex migration paths and higher barriers than smaller clusters. Finally, the direct comparison with the DFT results shows that EAM can accurately describe the vacancy-induced relaxation effects in the Cu bulk and in grain boundaries. Significant discrepancies between the two methods were found in structures with a higher number of low-coordinated atoms, such as penta-vacancies and di-vacancy absortion by grain boundary. These results will be useful for modeling the mechanisms of diffusion of complex defect structures and provide further insights into the structural evolution of metal films under thermal and mechanical stress.

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Drop Shock Test of PCB at Elevated Temperature

Vyas,

Alahmer,

Bolanos

et al. 2024

2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

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Impact of an Elevated Temperature Environment on Sn-Ag-Cu Interconnect Board Level High-G Mechanical Shock Performance

Cited by 5 publications

References 12 publications

Comparative Analysis of SAC Solder Alloys for Enhanced Reliability in Electronic Assemblies: A Finite Element Approach

Comparative Analysis of SAC Solder Alloys for Enhanced Reliability in Electronic Assemblies: A Finite Element Approach

Structure and Migration Mechanisms of Small Vacancy Clusters in Cu: A Combined EAM and DFT Study

Drop Shock Test of PCB at Elevated Temperature

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