Impact of bonding methods and surface finishes on terminal-substrate reliability in EV power modules

Kim, Hyeon-Tae; Lee, Dong-Bok; Lim, Kwan-Soo; Lee, Ji-Hyung; Park, Semin; Oh, Chul-Min; Yoon, Jeong-Won

doi:10.1007/s10854-024-13371-0

J Mater Sci: Mater Electron

2024

DOI: 10.1007/s10854-024-13371-0

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Impact of bonding methods and surface finishes on terminal-substrate reliability in EV power modules

Hyeon-Tae Kim,

Dong-Bok Lee,

Kwan-Soo Lim

et al.

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Impact of bonding methods and surface finishes on terminal-substrate reliability in EV power modules

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References 26 publications

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