2021
DOI: 10.1016/j.solener.2021.08.075
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Impact of boron doping on electrical performance and efficiency of n-TOPCon solar cell

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Cited by 21 publications
(5 citation statements)
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“…The PID‐p susceptibility of the front face of the TOPCon module is attributable in part to the use of boron emitters with sheet resistivity around 180 Ω/◻ 23 and the low solubility of B in Si, which leads to relatively low peak concentration (1 × 10 19 cm −3 range) of B in the p + emitter 24 . An emitter with low p + concentration produces a weaker surface field, reducing the repulsion of minority carrier electrons from the front interface with the dielectric.…”
Section: Resultsmentioning
confidence: 99%
See 1 more Smart Citation
“…The PID‐p susceptibility of the front face of the TOPCon module is attributable in part to the use of boron emitters with sheet resistivity around 180 Ω/◻ 23 and the low solubility of B in Si, which leads to relatively low peak concentration (1 × 10 19 cm −3 range) of B in the p + emitter 24 . An emitter with low p + concentration produces a weaker surface field, reducing the repulsion of minority carrier electrons from the front interface with the dielectric.…”
Section: Resultsmentioning
confidence: 99%
“…The PID-p susceptibility of the front face of the TOPCon module is attributable in part to the use of boron emitters with sheet resistivity around 180 Ω/◻ 23 and the low solubility of B in Si, which leads to relatively low peak concentration (1 Â 10 19 cm À3 range) of B in the p + emitter. 24 An emitter with low p + concentration produces a weaker surface field, reducing the repulsion of minority carrier electrons from the front interface with the dielectric. Then, under negative system voltage, more front surface recombination results from positive charge migrating through the front-side encapsulation toward the dielectric that can further attract minority carrier electrons from the underlying p + emitter.…”
Section: Pid-p Stress and Recovery Test Under Dark Conditionsmentioning
confidence: 99%
“…J 0,measured plots of n + -poly-Si layers of various thicknesses with different metallization fractions are depicted in Figure 4 . The values of J 0, metal are determined through a straightforward linear interpolation of the measured data points [ 42 , 43 , 44 ]. The results indicate that the n + -poly-Si layers with a thickness of 100 nm have the lowest J 0,measured values, approximately 26 fA/cm 2 .…”
Section: Resultsmentioning
confidence: 99%
“…Wafers with different P-doped poly-Si film thicknesses using two-sided passivation of the SiN x layer were used as J 0 samples. Similar samples with polished surfaces were screen-printed with Ag paste lines on one side only and nine different pitches were used as J 0, metal samples; these which were placed with the fingers facing up and then sintered in a sintering furnace at a peak temperature of 730 °C [ 42 , 43 , 44 ]. P-doped poly-Si contacts were fabricated with four different thicknesses (see Table 1 ).…”
Section: Methodsmentioning
confidence: 99%
“…Upgrades to boron diffusion equipment can allow a much higher process temperature up to 1050°C, which can significantly reduce the process time. At present, the boron diffused layer is mainly prepared by high‐temperature thermal diffusion, using either boron chloride (BCl 3 ) or BBr 3 as the boron source 50,51 . BCl 3 is a gaseous source, and BBr 3 is a liquid source, but both sources can obtain good sheet resistance uniformity on large industrial silicon wafers.…”
Section: Front‐side Fabrication and Metallisationmentioning
confidence: 99%