Impact of Co on Thermal Aging in Sn58Bi/Cu Solder Joints: IMC Growth and Transformation in Mechanical Properties

Effect of solder void on mechanical and thermal properties of flip-chip light-emitting diode: Statistical analysis based on finite element modeling

“…The performance of FCLEDs relies heavily on the material of the FCLED, the interconnecting solder material, and the substrate material of the printed circuit board (PCB). It has been widely reported that during the reflow process, when bonding the FCLED to the PCB, voids can form within the solder interconnect, causing chip-on-substrate level reliability issues [ [9] , [10] , [11] , [12] , [13] ]. These issues include increased thermal resistance and premature failure with an increased void volume fraction [ 14 ].…”