Impact of Cooling Rate and Nickel Addition on the Dendritic Spacing, Ag3Sn Morphology and Cytotoxicity of Sn-2Ag Solder

de Sousa, Raí Batista; Paixão, Jeverton Laureano; de Araújo Dantas, Suylan Lourdes; de Freitas, Pâmella Raffaela Dantas; da Luz, Jefferson Romáryo Duarte; Spinelli, José Eduardo; Silva, Bismarck Luiz

doi:10.1007/s11664-023-10685-3

J. Electron. Mater.

2023

DOI: 10.1007/s11664-023-10685-3

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Impact of Cooling Rate and Nickel Addition on the Dendritic Spacing, Ag3Sn Morphology and Cytotoxicity of Sn-2Ag Solder

Raí Batista de Sousa,

Jeverton Laureano Paixão,

Suylan Lourdes de Araújo Dantas

et al.

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2024

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Dendrite Growth in Single-Grain and Cyclic-Twinned Sn–3Ag–0.5Cu Solder Joints

Sun,

Gourlay

2024

Metall Mater Trans A

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The microstructure of electronic solder joints is generated by the solidification of a small volume of bulk undercooled liquid. Here, we study β-Sn dendrite growth in Sn–3Ag–0.5Cu in the specific geometry and nucleation conditions of ball grid array (BGA) solder joints by combining electron backscatter diffraction and imaging of microstructures. It is shown that, while $$\langle 110\rangle$$ ⟨ 110 ⟩ is the preferred dendrite growth direction, out-of-plane branching and growth with $$\langle 11W\rangle$$ ⟨ 11 W ⟩ directions are important for allowing dendrites to fan out into the spheroidal volume of BGA joints due to the low symmetry of β-Sn. We find that the crystallographic orientation of β-Sn at the nucleation point plays a strong role in subsequent dendrite growth. In single-grain joints, dendrites are often unfavorably oriented for growth, resulting in different types of zig-zag dendrite growth. In cyclic-twinned joints, it is shown how competitive out-of-plane trunk growth between three dendrite orientations produces {101} boundaries and the characteristic beachball microstructure.

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Dendrite Growth in Single-Grain and Cyclic-Twinned Sn–3Ag–0.5Cu Solder Joints

Sun,

Gourlay

2024

Metall Mater Trans A

View full text Add to dashboard Cite

show abstract

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Impact of Cooling Rate and Nickel Addition on the Dendritic Spacing, Ag3Sn Morphology and Cytotoxicity of Sn-2Ag Solder

Cited by 1 publication

References 35 publications

Dendrite Growth in Single-Grain and Cyclic-Twinned Sn–3Ag–0.5Cu Solder Joints

Dendrite Growth in Single-Grain and Cyclic-Twinned Sn–3Ag–0.5Cu Solder Joints

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