In
this paper, high-quality β-Ga2O3 films
were grown on silicon substrates by plasma-enhanced
atomic
layer deposition (PEALD). Effects of annealing temperature on β-Ga2O3 thin films were studied. Atomic force microscopy
(AFM), X-ray diffraction (XRD), X-ray photoelectron spectroscopy (XPS),
X-ray reflection (XRR), and ultraviolet (UV) emission spectroscopy
were used to systematically characterize Ga2O3 thin films. AFM test results showed that as annealing temperature
increased from 500 to 900 °C, the roughness of film increased
from 0.542 to 1.58 nm. XPS test results showed that the concentration
of oxygen vacancies in annealed films was significantly reduced. After
annealing, the energy band of the film increased from 4.73 to 5.01
eV, and the valence band maximum (VBM) increased from 2.58 to 2.67
eV, indicating that the annealing treatment under a nitrogen atmosphere
can improve the quality of films. Results demonstrate that high-quality
Ga2O3 films can be obtained by the annealing
process after atomic layer deposition (ALD). The proposed method can
realize an ideal stoichiometric ratio of the Ga2O3 thin film as well as precise control of its optical, electrical,
and microstructural properties. This work lays the foundation for
future application of Ga2O3 materials in photoelectric
detection, power devices, transparent electronics, and other fields.