“…To test the versatility of the fabrication process, we produce various patterns of arrays, including circles, ribbons, triangles, and squares. The final geometry of the Si arrays depends on processing parameters, including the thickness/shape of metal, the concentration of etchant, and the orientation/doping density of the substrate 2,5,21,26,34 . In this work, we used a 10 nm-thick patterned Au layer as a catalyst.…”