2014
DOI: 10.1016/j.snb.2013.11.009
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Impact of doping level on the metal assisted chemical etching of p-type silicon

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Cited by 19 publications
(13 citation statements)
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“…[12][13][14] Several prior studies focused on the morphological control of nanoporous Si and Si nanowires through varying the process parameters, such as the oxidant type, etchant concentration, reaction time, processing temperature and type of Si. [15][16][17][18][19][20][21][22][23][24][25][26][27][28][29][30][31][32][33] The theory of hole injection during etching is perhaps the most widely accepted mechanism for MacEtch. 4,[34][35][36][37][38] Many observations can be qualitatively explained by the holes' injection from noble metal particles as the catalyst into the Si substrate and the subsequent diffusion of holes within the Si substrate.…”
Section: Introductionmentioning
confidence: 99%
“…[12][13][14] Several prior studies focused on the morphological control of nanoporous Si and Si nanowires through varying the process parameters, such as the oxidant type, etchant concentration, reaction time, processing temperature and type of Si. [15][16][17][18][19][20][21][22][23][24][25][26][27][28][29][30][31][32][33] The theory of hole injection during etching is perhaps the most widely accepted mechanism for MacEtch. 4,[34][35][36][37][38] Many observations can be qualitatively explained by the holes' injection from noble metal particles as the catalyst into the Si substrate and the subsequent diffusion of holes within the Si substrate.…”
Section: Introductionmentioning
confidence: 99%
“…To test the versatility of the fabrication process, we produce various patterns of arrays, including circles, ribbons, triangles, and squares. The final geometry of the Si arrays depends on processing parameters, including the thickness/shape of metal, the concentration of etchant, and the orientation/doping density of the substrate 2,5,21,26,34 . In this work, we used a 10 nm-thick patterned Au layer as a catalyst.…”
Section: Resultsmentioning
confidence: 99%
“…Among existing solid substrates, silicon nanostructures (SiNSs) and metal-SiNSs composites are recognized as some of the potential and robust SERS-active substrates because of their admirable properties such as spatial selectivity during physical and chemical treatments, sustainable chemical tunability, surface roughness, earth-abundancy, and compatibility of today’s state-of-the-art technologies and are highly appreciated by the SERS community. , Moreover, these qualities offer the distribution of high-density plasmonic hot-spots across all the spatial planes (i.e., band edges and band gaps), which facilitate the better probability of trap target analytes in the hot-spot regions. Therefore, chemically processed silicon-based NSs show well adaptability in SERS molecular sensing. In the extended view, a comprehensive short review by Wang et al reported extensively on silicon-based SERS substrates for effective SERS sensing .…”
Section: Introductionmentioning
confidence: 99%