The characteristics of the dry etching of SiN :H thin films for display devices using SF 6 /O 2 and NF 3 /O 2 were investigated using a dual-frequency capacitively coupled plasma reactive ion etching (CCP-RIE) system. The investigation was carried out by varying the RF power ratio (13.56 MHz/2 MHz), pressure, and gas flow ratio. For the SiN :H film, the etch rates obtained using NF 3 /O 2 were higher than those obtained using SF 6 /O 2 under various process conditions. The relationships between the etch rates and the usual monitoring parameters-the optical emission spectroscopy (OES) intensity of atomic fluorine (685.1 nm and 702.89 nm) and the voltages and -were investigated. The OES intensity data indicated a correlation between the bulk plasma density and the atomic fluorine density. The etch rate was proportional to the product of the OES intensity of atomic fluorine ( (F)) and the square root of the voltages (√ ℎ + ) on the assumption that the velocity of the reactive fluorine was proportional to the square root of the voltages.