2015
DOI: 10.1134/s1063782615110263
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Impact of growth and annealing conditions on the parameters of Ge/Si(001) relaxed layers grown by molecular beam epitaxy

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Cited by 24 publications
(24 citation statements)
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“…It can be seen from the table that decrease of the Ge buffer thickness from 1 to 0.3 µm increases the density of threading dislocations by almost an order of magnitude according to the defect etching measurements. The latter agrees well with the results, obtained in [11] for similar annealing parameters. At the same time, the root-mean-square (RMS) roughness of the Ge buffer increased very slightly (from 1 to 1.3 nm), which may be caused by the smaller total aging time at elevated temperatures during cyclic annealing.…”
Section: Growth Of Ge Buffer Layer On Si Substratessupporting
confidence: 93%
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“…It can be seen from the table that decrease of the Ge buffer thickness from 1 to 0.3 µm increases the density of threading dislocations by almost an order of magnitude according to the defect etching measurements. The latter agrees well with the results, obtained in [11] for similar annealing parameters. At the same time, the root-mean-square (RMS) roughness of the Ge buffer increased very slightly (from 1 to 1.3 nm), which may be caused by the smaller total aging time at elevated temperatures during cyclic annealing.…”
Section: Growth Of Ge Buffer Layer On Si Substratessupporting
confidence: 93%
“…The exact (miscut from (001) is less than 0.5 • ) and 4 • offcut to [011] axis Ge/Si(001) virtual substrates were grown by solid source molecular beam epitaxy (MBE) using the Riber SIVA-21 machine using the so-called "two-step" growth strategy [9][10][11]. The growth temperature was controlled with a calibrated thermocouple [12] and a specialized infrared pyrometer IMPAC IS 12.…”
Section: Growth Of Ge Buffer Layer On Si Substratesmentioning
confidence: 99%
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“…Using modified growth techniques, e.g. two-step growth (Colace et al, 1998;Halbwax et al, 2005;Yurasov et al, 2015), graded buffering (Fitzgerald et al, 1988) or surfactant-mediated epitaxy (SME) (Copel et al, 1989;Wietler et al, 2006), islanding can be overcome and plastic relaxation is enforced.…”
Section: Epitaxial Growth Of Ge/si(001)mentioning
confidence: 99%
“…Росту соединений А III В V на SOI препятствуют такие же фундаментальные проблемы, какие встречаются при формировании А III В V на подложке Si и подробно описаны в обзорных публикациях [3,4]. Для решения фундаментальных проблем при эпитаксии материалов А III В V на Si применяется комплекс различных методов, которые представлены в работах [3][4][5][6][7], в том числе формирование буферных слоев Ge/Si между А III В V и Si [8,9]. Однако температурные режимы эпитаксии слоев Ge/Si на SOI и Si различаются из-за наличия скрытого слоя SiO 2 в SOI.…”
Section: Introductionunclassified