Compositionally graded epitaxial semiconductor buffer layers are prepared with the aim of using them as a virtual substrate for following growth of heterostructures with the lattice parameter different from that of the substrates available on market (GaAs, GaP, InP or InAs). In this paper we report on the preparation of the step graded InxGa 1−x P buffer layers on the GaP substrate. The final InxGa 1−x P composition x In was chosen to be at least 0.27 . At this composition the InxGa 1−x P band-gap structure converts from the indirect to the direct one and the material of such composition is suitable for application in light emitting diode structures. Our task was to design a set of layers with graded composition (graded buffer layer) and to optimize growth parameters with the aim to prepare strain relaxed template of quality suitable for the subsequent epitaxial growth.K e y w o r d s: crystal structure, organometallic vapor phase epitaxy (OMVPE), semiconducting III-V materials
INTRODUCTIONThe excellent properties of blue light emitting diodes (LEDs) based on nitride semiconductor compounds enabled the subsequent developments in solid state lighting. The red side of the visible spectrum is successfully covered with high brightness LED diodes based on (Al x Ga 1−x ) 0.5 In 0.5 P material lattice matched to GaAs. The low efficiency of green sources (so called "green or yellow gap") that are necessary for white and full color applications remains still a problem which has to be solved.One way how to do it is to use InGaN LEDs emitting blue light which is converted down by suitable color converter-phosphor. Such sources can be used for producing white light but they can also emit nearly monochromatic, high-color-purity light [1].Green light LED sources can be also realized on a base of (Al x Ga 1−x ) 0.5 In 0.5 P material lattice matched to GaAs and joined to the optically transparent GaP substrate by wafer bonding technique [2]. For green emission the content of Al has to be higher than 0.3. Increasing the Al content leads to significant decrease in internal radiative recombination efficiency and causes problems with p-type doping [3].Another approach is to prepare the light emitting structure in Al free In x Ga 1−x P ternary alloy deposited directly on GaP substrate. The In x Ga 1−x P alloy exhibits the direct band gap structure (energy gap of 2.24 eV, emission at 554 nm) for the indium content higher than 0.27. The disadvantage of this method is that the lattice parameter of In 0.27 Ga 0.73 P is about a 2.1 % higher than that of GaP substrate. It is necessary to insert between the substrate and the active region an intermediate layer enabling the change of the lattice constant from the substrate to the final active layer. Very important function of this layer is to be able to filter the dislocation propagation to the electroluminescent part of the structure. What is convenient, such graded buffer will be optically transparent for light emitted from LED because of decreasing band-gap with increasing indium content...