Thick GaN layers
with a low concentration of defects
are the key
to enable next-generation vertical power electronic devices. Here,
we explore hot-wall metalorganic chemical vapor deposition (MOCVD)
for the development of GaN homoepitaxy. We propose a new approach
to grow high-quality homoepitaxial GaN in N2-rich carrier
gas and at a higher supersaturation as compared to heteroepitaxy.
We develop a low-temperature GaN as an optimum nucleation scheme based
on the evolution and thermal stability of the GaN surface under different
gas compositions and temperatures. Analysis in the framework of nucleation
theory of homoepitaxial layers simultaneously grown on GaN templates
on SiC and on hydride vapor phase epitaxy GaN substrates is presented.
We show that residual strain and screw dislocation densities affect
GaN nucleation and subsequent growth leading to distinctively different
morphologies of GaN homoepitaxial layers grown on GaN templates and
native substrates, respectively. The established comprehensive picture
provides a guidance for designing strategies for growth conditions
optimization in GaN homoepitaxy. GaN with atomically flat and smooth
epilayer surfaces with a root-mean-square roughness value as low as
0.049 nm and low background carbon concentration of 5.3 × 1015 cm–3 has been achieved. It is also shown
that there is no generation of additional dislocations during homoepitaxial
growth. Thus, our results demonstrate the potential of the hot-wall
MOCVD technique to deliver high-quality GaN material for vertical
power devices.