Impact of High Pressures on Au-Sn Solid Liquid Interdiffusion (SLID) Bonds

Abstract

This paper investigates the influence of high pressure on Au-Sn solid-liquid interdiffusion (SLID) bonds formed by bonding Si substrates to dies of either lead-zirconate titanate (PZT) with high surface roughness or Si with low surface roughness. Bonded samples were exposed to 1000 bar pressure in a silicone oil filled pressure vessel. Samples were characterized before and after exposure by means of scanning acoustic microscopy, optical microscopy and scanning electron microscopy with energy dispersive x-ray spectroscopy. All but one sample successfully passed the pressure exposure. This failed sample had a delamination in the proximity of a large void in the intermetallic layer.

Acoustic Characterization of Inhomogenous Layers using Finite Element Method

“…Our previous work [9] on the use of solid-liquid interdiffusion (SLID) bonding [10] in ultrasound transducers reported on the existence of voids in the metallurgical bondline. Such layers are challenging to characterize experimentally as the bondlines are thin and most often sandwiched in-between two layers.…”