Impact of intrinsic properties and interface contacts on thermoelectric transient supercooling

Ling, Yifeng; Qiu, Guojuan; Liu, Duo; Min, Erbiao; Feng, Jianghe; Li, Juan; Zhang, Ping; Sun, Rong; Liu, Ruiheng

doi:10.1016/j.applthermaleng.2022.119690

Cited by 8 publications

(2 citation statements)

References 37 publications

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“…Solid-state thermoelectric cooling (TEC) technology, which can directly convert electrical and thermal energy, has the advantages of compact size, no mechanical motion, high reliability, and high precision of temperature control [1][2][3]. To date, it has become an important heat management thermal profile used for infrared detection, [4] bioanalytical devices, [5] semiconductor lasers, [6] etc.…”

Section: Introductionmentioning

confidence: 99%

High Mechanical Property and Texture Degree of Hot-Extruded Bi0.905Sb0.095

Zhao,

Zhang,

Zhao

et al. 2024

Preprint

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Bi1-xSbx crystal is one of the best n-type thermoelectric materials below 200 K, but its weak mechanical strength hinders practical applications for deep refrigeration. Herein, we adopted the mechanical enhancement method of hot extrusion to investigate the comprehensive mechanical and thermoelectric properties of Bi0.905Sb0.095. It revealed that reducing the grain size of the matrix and increasing the extrusion ratio can improve the gain size uniformity and mechanical properties. While the thermoelectric performance depends on the texture, grain size, and local composition. The extruded sample prepared by ingot with the high extrusion ratio of 9:1 generated a high texture degree of (001) plane and small grain sizes between ~4-40 mm, which resulted in the high bending strength of Bi1-xSbx ~130 Mpa and a high-power factor of ~ 68 μW·cm-1·K-2@173 K, as well as the relative high figure of merit of 0.25@173K. This work highlights the importance of the uniform distribution of the grain size and the compositions for Bi1-xSbx, as well as the required universal key parameter for the hot-extrusion method.

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Section: Introductionmentioning

confidence: 99%

High Mechanical Property and Texture Degree of Hot-Extruded Bi0.905Sb0.095

Zhao,

Zhang,

Zhao

et al. 2024

Preprint

View full text Add to dashboard Cite

show abstract

Section: Introductionmentioning

confidence: 99%

High Mechanical Property and Texture Degree of Hot-Extruded Bi0.905Sb0.095

Zhao,

Zhang,

Zhao

et al. 2024

Crystals

View full text Add to dashboard Cite

Bi1−xSbx crystal is one of the best n-type thermoelectric materials below 200 K, but its weak mechanical strength hinders practical applications for deep refrigeration. Herein, we adopted the mechanical enhancement method of hot extrusion to investigate the comprehensive mechanical and thermoelectric properties of Bi0.905Sb0.095. It revealed that reducing the grain size of the matrix and increasing the extrusion ratio can improve the gain size uniformity and mechanical properties. Meanwhile, the thermoelectric performance depends on the texture, grain size, and local composition. The extruded sample prepared by ingot with the high extrusion ratio of 9:1 generated uniform small grains, which resulted in the high bending strength of Bi1−xSbx~130 Mpa and a high power factor of ~68 μW·cm−1·K−2@173 K, as well as the relatively high figure of merit of 0.25@173K. This work highlights the importance of the uniform distribution of the grain size and the compositions for Bi1−xSbx, as well as the required universal key parameter for the hot extrusion method.

show abstract

Precise temperature control of electronic devices under ultra-high thermal shock via thermoelectric transient pulse cooling

Ling,

Min,

Dong

et al. 2023

Applied Energy

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Impact of intrinsic properties and interface contacts on thermoelectric transient supercooling

Cited by 8 publications

References 37 publications

High Mechanical Property and Texture Degree of Hot-Extruded Bi<sub>0.905</sub>Sb<sub>0.095</sub>

High Mechanical Property and Texture Degree of Hot-Extruded Bi<sub>0.905</sub>Sb<sub>0.095</sub>

High Mechanical Property and Texture Degree of Hot-Extruded Bi0.905Sb0.095

Precise temperature control of electronic devices under ultra-high thermal shock via thermoelectric transient pulse cooling

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