A novel 3D NOR memory array with singlecrystal silicon channel, high-density and fast-read was proposed and fabricated. The proposed 3D NOR memory is investigated in terms of device structure, integration scheme, and circuit architecture. To obtain single-crystal silicon channel for 3D NOR, 1) vertical flash devices were presented, 2) a stack with multiple doped epitaxial Si layers was used for making the vertical devices, and 3) unlike 3D NAND, bit-line planes, source-line planes and vertical word-lines were utilized. Due to the use of single-crystal silicon channels, our memory devices have large read currents of 110 µA/µm. Through programming/erasing tests, the programming speed of 10 µs and erasing speed of 100 ms were obtained, which are comparable to that of the 2D NOR Flash with single-crystal silicon channels.