2018 IEEE 30th International Symposium on Power Semiconductor Devices and ICs (ISPSD) 2018
DOI: 10.1109/ispsd.2018.8393666
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Impact of self-heating effect in hot carrier injection modeling

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“…This will make it harder for the hot-carriers to lose heat, increasing the device temperature. This self-heating effect will increase the degradation rate for BTI and HCI in smaller devices [172,173], however, a higher temperature may also favor a higher recovery rate (see Section 5). The effect on the number of fins in a FinFET on the HCD is studied in [174,175], where is reported that an increase in the number of fins makes it harder to lose the generated heat, i.e.…”
Section: Thermal Degradation and Heating Effectsmentioning
confidence: 99%
“…This will make it harder for the hot-carriers to lose heat, increasing the device temperature. This self-heating effect will increase the degradation rate for BTI and HCI in smaller devices [172,173], however, a higher temperature may also favor a higher recovery rate (see Section 5). The effect on the number of fins in a FinFET on the HCD is studied in [174,175], where is reported that an increase in the number of fins makes it harder to lose the generated heat, i.e.…”
Section: Thermal Degradation and Heating Effectsmentioning
confidence: 99%