Impact of system level thermal solution on the interconnect reliability of high performance and high heat dissipating CSP package

Ahmad, Mudasir; Liu, K.C.; Lee, C.J.; Priest, Judy; Pak, Sung-Ju; Narasimhan, Sridhar; Nagar, Mohan; Xue, Jie

doi:10.1109/ectc.2008.4549993

2008 58th Electronic Components and Technology Conference 2008

DOI: 10.1109/ectc.2008.4549993

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Impact of system level thermal solution on the interconnect reliability of high performance and high heat dissipating CSP package

Mudasir Ahmad¹,

K.C. Liu²,

C.J. Lee³

et al.

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2010

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Board level solder joint reliability model for flip-chip ball grid array packages under compressive loads

Chiu

Lin

Gupta

et al. 2010

2010 12th Electronics Packaging Technology Conference

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The ever increasing power density in high performance microelectronic devices for large business computing and telecommunication infrastructure has led to several new reliability challenges for solder interconnects. One of them is the creep collapse and bridging of ball grid array (BGA) solder joints under heatsink compressive loads. In this study, the effect of heatsinking compressive load on the solder joint reliability is investigated by using both experimental and numerical approaches. A phenomenological life prediction model for both Sn36Pn2Ag and Sn3.8Ag0.7Cu solder joints subjected to constant compressive load is also proposed.

show abstract

Board level solder joint reliability model for flip-chip ball grid array packages under compressive loads

Chiu

Lin

Gupta

et al. 2010

2010 12th Electronics Packaging Technology Conference

View full text Add to dashboard Cite

show abstract

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Impact of system level thermal solution on the interconnect reliability of high performance and high heat dissipating CSP package

Cited by 1 publication

References 2 publications

Board level solder joint reliability model for flip-chip ball grid array packages under compressive loads

Board level solder joint reliability model for flip-chip ball grid array packages under compressive loads

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