This
study describes the effect of a thin GaAs spacer of 4.5 nm
thickness in a bilayer-coupled InAs quantum dot (QD) heterostructure.
Here, we report the first demonstration of InAs/GaAs QDs capped by
self-assembled In
x
Ga1–x
As layers. Self-assembled In
x
Ga1–x
As layers were introduced
into each intermediate layer across the interface of InAs QDs and
the GaAs layer in a vertical-coupled bilayer QD (VCBQD) heterostructure
to prevent indium desorption from the QDs. A change in the indium
content in the seed-layer InAs QDs changes the self-assembly position
and modifies the In
x
Ga1–x
As layer thickness. A theoretical approach was presented
to study the formation of self-assembled In
x
Ga1–x
As layers at each strain-free
layer. We showed that the strain energy at the second intermediate
(ε
zz2) layer is greater than that
at the first intermediate (ε
zz1)
layer; ε
zz2 depends on the vertical
strain channel length. The impact of the In
x
Ga1–x
As layer thickness
on the strain energy was studied using high-resolution transmission
electron microscopy; a shorter strain channel length was found to
facilitate the formation of a more relaxed and larger-sized self-assembled
In
x
Ga1–x
As layer in the active layer. This In
x
Ga1–x
As layer formed at the intermediate
layer acts as a capping layer or a protective shield for the indium
adatoms, preventing their desorption from the InAs QDs. Furthermore,
we studied the thermal stability of the self-assembled In
x
Ga1–x
As layer
by annealing the VCBQD samples at 700 and 800 °C. This aspect
has been investigated for the first time ever in a study of the coupling
efficiency between the InAs QDs and In
x
Ga1–x
As capping layer. A high-resolution
in-plane (2θχ/ϕ) reciprocal space mapping (RSM)
technique provided the connection between the in-plane reciprocal
lattice point of the InAs QDs and In
x
Ga1–x
As layers and revealed the strain
and coupling between them. InAs QDs fully covered with the self-assembled
In
x
Ga1–x
As layer enhanced the photoluminescence intensity by 77% and had
an activation energy of 467 meV.