Implementation and characterization of a quality-factor-controllable micromachined inductor

Huang, Yu-Che; Jang, Ben-Hwa; Fang, Weileun

doi:10.1109/nems.2011.6017564

Cited by 1 publication

(1 citation statement)

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“…Table I summarizes the RF properties of both the inductors. Also, at this point, we compare performances of some self-assembled inductors [18]- [20], [29]- [33] with the HR inductor described in this work, as summarized in Table II.…”

Section: B Rf Analysismentioning

confidence: 99%

A 1.3–2.4-GHz 3.1-mW VCO Using Electro-Thermo- Mechanically Tunable Self-Assembled MEMS Inductor on HR Substrate

Bhattacharya

Mandal

Bhattacharyya

2015

IEEE Trans. Microwave Theory Techn.

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This paper reports implementation and wafer-level testing of a self-assembled tunable microelectromechanical systems (MEMS) inductor with electrostatic, electrothermal, and thermal tuning capability. The surface micromachined inductor was fabricated on a high-resistivity (HR) substrate ( k cm) using a doped polysilicon and Au-Cr metal combination as a bimorph structural layer for providing self-assembled elevation with an enhanced factor. Extensive electro-thermo-mechanical and RF characterization was carried out for the inductor, the latter over a temperature range from 30 C to 150 C. Furthermore, the tunable inductor was integrated in the tank circuit of a CMOS oscillator and wafer-level MEMS-CMOS voltage-controlled oscillator testing revealed a best figure-of-merit of 197.6 dB with a frequency tuning range of 1.3-2.4 GHz with a power consumption of 3.07 mW.Index Terms-Bond wire, high-resistivity (HR) substrate, microelectromechanical systems (MEMS) inductor, quality factor, selfassembly, voltage-controlled oscillator (VCO).

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Section: B Rf Analysismentioning

confidence: 99%