International Communications in Heat and Mass Transfer
 2024
DOI: 10.1016/j.icheatmasstransfer.2024.108274
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Implicit modular coupled heat transfer analysis for high-temperature participating media using the SVC-FMC method with superposition principle

Ze-Yu Zhu,
Bao-Hai Gao,
Zhi-Tian Niu
et al.
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