Imprint-Through Mold Via (i-TMV) with High Aspect Ratio and Narrow Pitch for Antenna in Package

Li, Xinrong; Ogawa, Tomoko; Shibata, Tetsuichi; Yoneda, Satoshi; Suzuki, N.; Nonaka, Takamasa

doi:10.1109/ectc32862.2020.00032

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Imprint-Through Mold Via (i-TMV) with High Aspect Ratio and Narrow Pitch for Antenna in Package

Cited by 4 publications

References 3 publications

The effects of pressure, temperature, and depth/diameter ratio on the microvia filling performance of Ag-coated Cu micro-nanoparticles for advanced electronic packaging

The effects of pressure, temperature, and depth/diameter ratio on the microvia filling performance of Ag-coated Cu micro-nanoparticles for advanced electronic packaging

Bendability Enhancement and Miniaturization of Through-X Via (TXV) Based on Flexible FOWLP with Tiny Cu Pillar Assembly

Imprint-Through Mold Via (i-TMV) with Highly-Effective Electromagnetic Interference Shielding for RF devices

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