Improved Adhesion of Dense Silica Coatings on Polymers by Atmospheric Plasma Pretreatment

Cui, Lele; Ranade, Alpana N.; Matos, Marvi A.; Dubois, Géraud; Dauskardt, Reinhold H.

doi:10.1021/am401921k

Cited by 30 publications

(46 citation statements)

References 38 publications

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“…The maximum fracture energy was obtained at the optimal sintering temperature of 250 °C due to the significant increase in surface roughness and the presence of sufficient amount of organic residues at the interface, as confirmed by the AFM and XPS analyses. The increase of the surface roughness plays a critical role in the adhesion enhancement . At this temperature, the grain growth and coarsening of the Ag nanoparticles resulted in increased surface roughness, and this promoted mechanical interlocking between the film and organic residues.…”

Section: Resultsmentioning

confidence: 99%

Enhancing Adhesion of Screen‐Printed Silver Nanopaste Films

Kim

Jang

et al. 2015

Adv Materials Inter

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such as silicon, paper, polymer, and fabric. Therefore, the screen-printing method has been widely adopted for electronic circuits using metal nanoparticles, [ 8,15,16 ] organic light-emitting devices, [ 17,18 ] and for energy conversion devices, including solar, [ 12,19,20 ] and fuel cells. [ 21,22 ] Despite the advantages of the solution-based screen-printing process, the reliability of printed metal nanoparticle fi lms has always been a concern due to their limited mechanical characteristics. The printed electronic devices are often exposed to harsh operating environments, such as high humidity, mismatch in coeffi cients of thermal expansion (CTE), and repeated loading/unloading. Furthermore, the reliability problems become critical for fl exible electronics due to large deformations that result from their stretchable and bendable characteristics. These issues cause mechanical damage in printed fi lms, including cracks and delamination. Subsequently, they cause mechanical/electrical degradation in the devices. The mechanical properties and reliabilities of printed metal nanoparticle fi lms have therefore been investigated using various techniques, such as tensile, [23][24][25] bending, [ 15 ] and indentation tests. [ 26 ] Nevertheless, the characteristics of interfacial adhesion between the printed fi lms and the substrate that directly infl uence mechanical reliability have received little attention and have not been systematically investigated. Previous interfacial adhesion studies on printed metal nanoparticle fi lms using peel, [ 27 ] friction, [ 28 ] and shear tests [ 29 ] were indirect approaches without fundamental mechanisms. Although the adhesion properties using double cantilever beam (DCB) test have been reported, [ 30 ] it was limited only to the spin-coated silver ink for inkjet applications with impractical sintering times of a few hours. Considering the signifi cant technological and industrial importance of screen-printed metal nanopastes in electronic devices, it is essential to enhance the interfacial adhesion properties and to investigate the fundamental adhesion mechanisms. However, the adhesion of screen-printed metal nanopaste has not been systematically studied.In this study, we quantify the interfacial fracture energy of screen-printed Ag nanopaste fi lms on silicon substrates using DCB fracture mechanics tests. The results demonstrate that the interfacial fracture energy can be maximized at the optimum sintering temperature. To verify the interfacial adhesion mechanism of the screen-printed Ag nanopaste fi lms, the microstructures of fi lms and delaminated surfaces are characterized using scanning electron microscopy (SEM), atomic force microscopy (AFM), and X-ray photoelectron spectroscopy (XPS). Notably, The interfacial fracture energy of screen-printed silver nanopaste fi lms is quantitatively measured, and the fundamental adhesion mechanism is investigated. It is found that the interfacial fracture energy at the Ag fi lm/ silicon substrate interface is critically affected by the si...

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Section: Resultsmentioning

confidence: 99%

Enhancing Adhesion of Screen‐Printed Silver Nanopaste Films

Kim

Jang

et al. 2015

Adv Materials Inter

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“…The precursor for deposition (e.g., tetraethoxysilane, TEOS, as the precursor of SiO 2 ) is carried by the working gas (e.g., argon, Ar) and blown into the dielectric‐barrier‐discharge region through the gas system (Figure d,e). Note that most previous atmospheric pressure PECVD processes use the configuration of stationary electrodes so that the deposition is performed on a limited area (e.g., 2–50 mm diameter) restrained by the finite electrode size, which is not viable for high‐throughput fabrication. By contrast, in this work we use a dynamic deposition where the target material moves through the two‐parallel stripe‐shaped electrodes in a controlled fashion, enabling continuous and autonomous deposition.…”

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confidence: 99%

A Scalable, High‐Throughput, and Environmentally Benign Approach to Polymer Dielectrics Exhibiting Significantly Improved Capacitive Performance at High Temperatures

et al. 2018

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Dielectric capacitors are the key components in advanced electronics and electrical systems owing to their highest power density among the electrical energy devices. [1][2][3][4][5][6][7] While ceramic dielectrics are of large dielectric constants and high thermal stability, [8][9][10][11][12] polymer dielectrics possess high tolerance to voltage, great reliability, scalability, and light weight, and therefore are preferred for high-energy-density high-power film capacitors. [13][14][15][16][17] However, the current polymer dielectrics are unable to match the temperature requirements of the emerging applications of electrical energy storage and conversion in harsh environments [18][19][20][21][22] because of their inherently poor thermal stability. For example, while the near-engine-temperature in electric vehicles can reach to above 120 °C, [23] the operating temperature of biaxially oriented polypropylene (BOPP), which is the best commercially available polymer dielectric and currently used in power inverters of electric vehicles, is below 105 °C. [24] The wide bandgap semiconductors like silicon carbide (SiC) and gallium nitride that are well positioned to replace traditional silicon power devices boost the operating temperatures of next-generation capacitors beyond 150 °C. [19] To address these urging needs, a variety of engineering polymers with high thermal stability, such as polyimides (PIs) and fluorene polyesters (FPEs), have been exploited as high-temperature dielectric materials. [20,25] Unfortunately, all the polymers show poor charge-discharge efficiencies under elevated temperatures and high applied fields, [26] which is due to sharply increased electrical conduction attributable to various temperature-and field-dependent conduction mechanisms, e.g., charge injection at the electrode/dielectric interface. [27,28] Ceramic dielectrics are relatively insensitive to temperature and able to maintain the energy-storage performance throughout a broad temperature range, [8][9][10][11][12] but they still suffer from considerable energy loss under high electric fields and elevated temperatures. [29] More recently, the addition of 2D wide bandgap nanostructures such as boron nitride nanosheets (BNNSs) into the polymer has been demonstrated to effectively reduce the conduction loss and largely improve the charge-discharge High-temperature capability is critical for polymer dielectrics in the nextgeneration capacitors demanded in harsh-environment electronics and electrical-power applications. It is well recognized that the energy-storage capabilities of dielectrics are degraded drastically with increasing temperature due to the exponential increase of conduction loss. Here, a general and scalable method to enable significant improvement of the high-temperature capacitive performance of the current polymer dielectrics is reported. The high-temperature capacitive properties in terms of discharged energy density and the charge-discharge efficiency of the polymer films coated with SiO 2 via plasma-enhanced chemical...

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“…Generally, oxidation reactions that impart alcohol (see Fig. ) and/or carboxyl, ketone, hydroperoxy functionalities to hydrophobic polymers such as PiBMA are anticipated to result in an increase in surface energy . To confirm this qualitatively, the water contact angle of PiBMA films containing 10 wt% DBA was measured after various processing steps and the results are shown in Figure .…”

Section: Resultsmentioning

confidence: 88%

“…4) and/or carboxyl, ketone, hydroperoxy functionalities to hydrophobic polymers such as PiBMA are anticipated to result in an increase in surface energy. [44][45][46][47] To confirm this qualitatively, the water contact angle of PiBMA films containing 10 wt% DBA was measured after various processing steps and the results are shown in Figure 8. These films possess a static water contact angle of 85.3 (6 0.8), and this value is unchanged after blanket photoexposure times typically used for patterning.…”

Section: Physical Patterning Mechanismmentioning

confidence: 94%

Surface energy gradient driven convection for generating nanoscale and microscale patterned polymer films using photosensitizers

Kim

Janes

McGuffin

et al. 2014

J. Polym. Sci. Part B: Polym. Phys.

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The Marangoni effect describes how fluid flows in response to gradients in surface energy. This phenomenon could be broadly harnessed to pattern the surface topography of polymer films if generalizable techniques for programming surface energy gradients existed. Here, a near UV–visible light (NUV–vis) photosensitizer, 9,10‐dibromo‐anthracene (DBA), was doped into thin films of a model polymer, poly(isobutyl methacrylate). After exposure to light through a photomask and heating above the glass transition, thermolysis of photo‐oxidized DBA and grafting to the polymer promoted flow of the film material into the exposed regions. This mechanism did not significantly alter the molecular weight of PiBMA or the film's glass transition temperature, but resulted in an increase in film surface energy as indicated by a decrease in water contact angle. Film height variations of 580 nm were produced using a mask with 12.5 μm features; a mask with 800 nm features was also employed to generate topographic features of corresponding width without expensive contacting equipment. Due to the broad absorbance spectra of DBA, highly accessible and/or unconventional light sources may be employed in this process; this advantage was demonstrated by patterning with sunlight. The nonspecific radical‐mediated nature of the DBA grafting reaction makes this a promising approach for many classes of polymers. © 2014 Wiley Periodicals, Inc. J. Polym. Sci., Part B: Polym. Phys. 2014, 52, 1195–1202

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Improved Adhesion of Dense Silica Coatings on Polymers by Atmospheric Plasma Pretreatment

Cited by 30 publications

References 38 publications

Enhancing Adhesion of Screen‐Printed Silver Nanopaste Films

Enhancing Adhesion of Screen‐Printed Silver Nanopaste Films

A Scalable, High‐Throughput, and Environmentally Benign Approach to Polymer Dielectrics Exhibiting Significantly Improved Capacitive Performance at High Temperatures

Surface energy gradient driven convection for generating nanoscale and microscale patterned polymer films using photosensitizers

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