The interface thermal
resistance (ITR) of thermal interface materials
is discussed in terms of electronic unit heat dissipation. To reduce
the ITR of heat-conducting silicone grease (HCSG), low melting-point
alloys (LMPAs) are introduced using boron nitride nanosheets (BNNS)
via a simple route for thermal management. The results reveal that
LMPAs uniformly compound and coat BNNS at the nanometer level. The
BNNS narrows the LMPAs’ melting range. After reaching the melting
point, the composite powder shows a degree of surface wettability.
HCSG’s thermal conductivity, prepared using the above composite
powder, reaches 1.8 W/(m·K), and its ITR drops from 13.8 to 0.547
°C·cm2/W. HCSG also has good recycling stability.