Improved assembly processes for the Quartz Digital Accelerometer cantilever

Abstract

This report covers the developmer, t of improved assembly processes for the Quartz Digital Accelerometer cantilever. In this report we discuss improved single-assembly tooling, the development of tooling and processes for precision application of polyimide adhesive, the development of the wafer scale assembly procedure, and the application of eutectic bonding to cantilever assembly. Joyce Torres of Ktech, for her conscientious assembJy of cantilevers with several iterations of tooling, and for performing the slew tests on the assemblies. Paul Vianco, Div. 2532, for his thorough studies and careful development of the eutectic bond process. R. Rossmeisl of GEND, for his critique of the tooling and processes. J. Staudte of XECO, for his consultation on various aspects of the tuning forks and wafers affecting tooling and bonding.