Improved dispersion of aluminum nitride particles in epoxy resin by adsorption of two-layer surfactants

Lee, Eun-Sung; Lee, Sang-Mock; Cannon, W. Roger; Shanefield, Daniel J.

doi:10.1016/j.colsurfa.2007.08.045

Cited by 16 publications

(12 citation statements)

References 16 publications

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“…In the previous paper it was shown that an optimum two‐layer composition was S32 and BYK surfactant 9 . In this paper we also investigated S42 as a coupling agent.…”

Section: Resultsmentioning

confidence: 95%

“…2 as a function of solids loading. High solids loading up to 57 vol% was achieved with the wide distribution of AlN powder (GAT) and epoxy resin, with the help of these two layers of dispersants (silane coupling agent+dispersants) 9 . The inflection points, the points at which the viscosity suddenly increases, were in the range of 30%–36% for as‐received AlN slip and 45%–51% for dispersant‐added pastes.…”

Section: Resultsmentioning

confidence: 99%

“…The objective of this study is to disperse a high volume percentage of AlN in epoxy resin using methods discussed in a previous paper 9 . Maintaining relatively low viscosity is important when the composite is coated onto the silicon IC chip.…”

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

Enhanced Thermal Conductivity of Polymer Matrix Composite via High Solids Loading of Aluminum Nitride in Epoxy Resin

Lee¹,

Lee²,

Shanefield³

et al. 2008

Journal of the American Ceramic Society

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Most semiconductor devices are now packaged in an epoxy polymer composite, which includes silica powder filler for reducing the thermal expansion coefficient. However, increased heat output from near‐future semiconductors will require higher thermal conductivity fillers such as aluminum nitride (AlN) powder, instead of silica. Dispersant chemistry is applied, in order to achieve a high volume percentage of AlN powder in epoxy without causing excessive viscosity before the epoxy monomer is crosslinked, thereby increasing the thermal conductivity of the composite. In the preliminary experiment, high solids loading, up to 57 vol%, was achieved with a wide particle size distribution, and the viscosity of that dispersion was 60 000 to 90 000 cps, resulting in easy flow by gravity alone at room temperature. The highest thermal conductivity of the composites measured by the hot‐disk method was 3.39 W/mK, which is approximately 15 times higher than pure epoxy. The Agari and Uno model was a good fit to the experimental data. Electronic I–V curves obtained after encapsulation of testing devices indicated that the highly AlN‐filled epoxy slip appeared to be feasible for use in the encapsulation of integrated circuit chips.

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“…In the previous paper it was shown that an optimum two‐layer composition was S32 and BYK surfactant 9 . In this paper we also investigated S42 as a coupling agent.…”

Section: Resultsmentioning

confidence: 95%

Section: Resultsmentioning

confidence: 99%

See 1 more Smart Citation

Enhanced Thermal Conductivity of Polymer Matrix Composite via High Solids Loading of Aluminum Nitride in Epoxy Resin

Lee¹,

Lee²,

Shanefield³

et al. 2008

Journal of the American Ceramic Society

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200

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“…The hydroxyl groups on the surface of the nanoparticles can accelerate the hydrolysis reaction and silane reacts with these hydroxyl groups [51,52]. The effect of the coupling agent is an alteration of the adhesion between filler and polymer matrix in the composite, which in turn can change the composite properties [53][54][55]. An example of the FTIR spectra of as-received and GPS treated nanoalumina particles are shown in figure 2.…”

Section: Surface Modification Of Nanoparticlesmentioning

confidence: 99%

Modelling of the thermal conductivity in polymer nanocomposites and the impact of the interface between filler and matrix

Kochetov¹,

Korobko²,

Andritsch³

et al. 2011

J. Phys. D: Appl. Phys.

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In this paper the thermal conductivity of epoxy-based composite materials is analysed. Twoand three-phase Lewis-Nielsen models are proposed for fitting the experimental values of the thermal conductivity of epoxy-based polymer composites. Various inorganic nano-and microparticles were used, namely aluminium oxide, aluminium nitride, magnesium oxide and silicon dioxide with average particle size between 20 nm and 20 µm. It is shown that the filler-matrix interface plays a dominant role in the thermal conduction process of the nanocomposites. The two-phase model was proposed as an initial step for describing systems containing 2 constituents, i.e. an epoxy matrix and an inorganic filler. The three-phase model was introduced to specifically address the properties of the interfacial zone between the host polymer and the surface modified nanoparticles.

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“…However, such molecular structure limits its steric stabilization in a nonaqueous dispersive system. 7,8 To overcome the limitations of traditional dispersants in the nonaqueous dispersion system, a new type of polymer dispersant so called hyper-dispersant, which has the unique dispersion effect on the nonaqueous dispersion system, has recently gained increasing attention. 9,10 It actually has two different functional groups, one is the anchoring group which attracts to the surface of the fillers and the other is the solvable chain which is compatible with the resin.…”

Section: Introductionmentioning

confidence: 99%

Synthesis of silicon ester dispersants and its application in CaCO₃/polyethylene composites

Liu

Ren

et al. 2010

J of Applied Polymer Sci

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Silicon ester dispersants were prepared using transesterification between ethyl petroleum silicate and the alkyl alcohols by different molecular masses. The dispersants were used to modify calcium carbonate (CaCO 3 ), and their effect on the mechanical properties of CaCO 3 /polyethylene (PE) composites was investigated. The transesterification was confirmed by gas chromatography (GC). The optimal conditions for the preparation of silicon ester dispersants were 110 C for 3 h with 2% catalyst by weight and fixed molar ratio of isooctyl alcohol to ethyl petroleum silicate of 3 : 1. Fourier transmission infrared spectroscopy (FTIR) results indicated that the dispersants were coating to the CaCO 3 particles. Dispersant with octadecanol as its solvable chain enabled the best modification effect. CaCO 3 /PE composites modified by dispersants demonstrated improved mechanical properties.

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Improved dispersion of aluminum nitride particles in epoxy resin by adsorption of two-layer surfactants

Cited by 16 publications

References 16 publications

Enhanced Thermal Conductivity of Polymer Matrix Composite via High Solids Loading of Aluminum Nitride in Epoxy Resin

Enhanced Thermal Conductivity of Polymer Matrix Composite via High Solids Loading of Aluminum Nitride in Epoxy Resin

Modelling of the thermal conductivity in polymer nanocomposites and the impact of the interface between filler and matrix

Synthesis of silicon ester dispersants and its application in CaCO₃/polyethylene composites

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Improved dispersion of aluminum nitride particles in epoxy resin by adsorption of two-layer surfactants

Cited by 16 publications

References 16 publications

Enhanced Thermal Conductivity of Polymer Matrix Composite via High Solids Loading of Aluminum Nitride in Epoxy Resin

Enhanced Thermal Conductivity of Polymer Matrix Composite via High Solids Loading of Aluminum Nitride in Epoxy Resin

Modelling of the thermal conductivity in polymer nanocomposites and the impact of the interface between filler and matrix

Synthesis of silicon ester dispersants and its application in CaCO3/polyethylene composites

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Synthesis of silicon ester dispersants and its application in CaCO₃/polyethylene composites