Detection in short-wave
infrared (SWIR) has become a very stringent
technology requirement for developing fields like hyperspectral imaging
or climate changes. In a market dominated by III–V materials,
GeSn, a Si compatible semiconductor, has the advantage of cost efficiency
and inerrability by using the mature Si technology. Despite the recent
progress in material growth, the easy fabrication of crystalline GeSn
still remains a major challenge, and different methods are under investigation.
We present the formation of GeSn nanocrystals (NCs) embedded in oxide
matrix and their SWIR characterization. The simple and cost-effective
fabrication method is based on thermal treatment of amorphous (Ge1–x
Sn
x
)
y
(SiO2)1–y
layers deposited by magnetron sputtering. The nanocrystallization
for Ge1–x
Sn
x
with 9–22 at. % Sn composition in SiO2 matrix
with 9% to 15% mole percent was studied under low thermal budget annealing
in the 350–450 °C temperature range. While the Sn at.%
content is the main parameter influencing the band-structure of the
NCs, the SWIR sensitivity can be optimized by SiO2 content
and H2 gas component in the deposition atmosphere. Their
role is not only changing the crystallization parameters but also
to reduce the carrier recombination by passivation of NCs defects.
The experiments indicate a limited composition dependent temperature
range for GeSn NCs formation before β-Sn phase segregation occurs.
NCs with an average size of 6 nm are uniformly distributed in the
film, except the surface region where larger GeSn NCs are formed.
Spectral photovoltaic current measured on SiO2 embedded
GeSn NCs deposited on p-Si substrate shows extended SWIR sensitivity
up to 2.4 μm for 15 at. % Sn in GeSn NCs. The large extension
of the SWIR detection is a result of many factors related to the growth
parameters and also to the in situ or ex
situ annealing procedures that influence the uniformity and
size distribution of NCs.