2013
DOI: 10.1016/j.susc.2013.01.010
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Improved graphene growth in UHV: Pit-free surfaces by selective Si etching of SiC(0001)–Si with atomic hydrogen

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Cited by 16 publications
(18 citation statements)
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“…Hydrogen can be also used to prepare atomically flat SiC surface by hydrogen etching 25 or pit-free surfaces by selective silicon etching at reduced growth temperatures. 26 The main objective of this work is to study Si-H bond formation and its temporal stability. This will provide a route towards reliable, back-gated epitaxial graphene of high carrier mobility.…”
Section: Introductionmentioning
confidence: 99%
“…Hydrogen can be also used to prepare atomically flat SiC surface by hydrogen etching 25 or pit-free surfaces by selective silicon etching at reduced growth temperatures. 26 The main objective of this work is to study Si-H bond formation and its temporal stability. This will provide a route towards reliable, back-gated epitaxial graphene of high carrier mobility.…”
Section: Introductionmentioning
confidence: 99%
“…The inhomogeneity of CuPc domain sizes is attributed to the large variation in the graphene defect density, as epitaxial graphene on SiC prepared in UHV is known to be extremely spatially inhomogeneous. 23 This is reflected in our AFM measurements shown in Figure 2a and 2b that show highly variable film morphology in different macroscopic surface regions.…”
Section: Resultsmentioning
confidence: 61%
“…This surface exhibits a regular array of triple-bilayer SiC steps (height 0.75 nm) which arise from the unavoidable miscut from the perfect (0001) plane, as well as random "etch pits" because of rapid thermal desorption of Si during graphene growth. 23 The single-layer graphene grown on single crystal SiC(0001) wafers has an added advantage of forming a continuous 2-D single crystal of graphene across the sample with essentially no rotational disorder in the plane of the surface. However, the intrinsic SiC surface steps and etch pits formed during graphene growth by thermal desorption of Si in ultrahigh vacuum give our graphene on SiC(0001) substrates substantially higher defect density than cleaved graphite.…”
Section: Resultsmentioning
confidence: 99%
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“…Thus far, various methods have been proposed to minimize etch pit formation during graphene growth. These approaches include the use of a vicinal SiC surface, 14 deposition of evaporated C atoms onto SiC, 15,16 rapid annealing of SiC, 17 selective etching of Si atoms in surface SiC layers by atomic hydrogen, 18 and the use of high background gas pressures during heating at temperatures above 1650°C. 19 In this paper, we investigate the use of plasma to avoid a pitted morphology on SiC during subsequent heating in UHV to grow graphene.…”
Section: Introductionmentioning
confidence: 99%