Improved HNA isotropic etching for large-scale highly symmetric toroidal silicon molds with &lt;10-nm roughness

Bai, Zesen; Wang, Yinpeng; Zhao, Qiancheng; Yang, Zhiqing; Cui, Jian; Yan, Guizhen

doi:10.1117/1.jmm.18.4.044501

Cited by 4 publications

(1 citation statement)

References 21 publications

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“…However, these quartz gyroscopes are extremely expensive due to serial manufacturing, polishing, and assembly process. Micro-HRGs have been recently demonstrated by (a) depositing structural thin-films on pre-defined molds [12,[14][15][16][17][18] and (b) glass-blowing or locally blow-torching the resonator [19,20]. These technologies are not only used for wafer-level manufacturing of HRGs, but also for various optical and magnetic sensing devices.…”

Section: Introductionmentioning

confidence: 99%

Deep isotropic chemical etching (DICE) process for fabricating highly symmetric hemispherical silicon molds

Jones¹,

Torunbalcı²,

Bhave³

2021

J. Micromech. Microeng.

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This paper introduces the deep isotropic chemical etching (DICE) process developed for wafer-scale manufacturing of highly symmetric hemispherical silicon molds. The DICE process uses silicon nitride concentric rings as a masking layer during hydrofluoric, nitric, acetic etching of silicon substrate. These concentric rings pop up and widen the etch aperture as etch depth increases, thereby allowing control of vertical and lateral etch rates until reaching the desired mold dimensions. Our comparative experiments demonstrate that the pop-up rings are remarkable at creating molds with enhanced symmetry compared to the conventional pinhole masks. We have demonstrated the effectiveness of our approach compared to single pinholes by producing a super-symmetric 0.1 mm hemispherical mold () using two concentric rings surrounding a pinhole. We have then shown how the DICE process can be used to fabricate larger silicon molds and presented the results of a single concentric ring that achieves fabrication of a 0.25 mm-deep mold with an aspect ratio of .

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Section: Introductionmentioning

confidence: 99%

Deep isotropic chemical etching (DICE) process for fabricating highly symmetric hemispherical silicon molds

Jones¹,

Torunbalcı²,

Bhave³

2021

J. Micromech. Microeng.

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Evolution of etch profile of <111> silicon in HNA solution

Xiong

Zhen

Wang

2022

Microelectronic Engineering

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Fabrication of Buried Microchannels with Almost Circular Cross-Section Using HNA Wet Etching

Yu,

Veltkamp,

Wiegerink

et al. 2024

Micromachines

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In this paper, a novel fabrication process for the realization of large, suspended microfluidic channels is presented. The method is based on Buried Channel Technology and uses a mixture of HF, HNO3, and water etchant, which has high selectivity between the silicon substrate and the silicon-rich silicon nitride mask material. Metal electrodes for actuation and read-out are integrated into the fabrication process. The microfluidic channels are released from the silicon substrate to allow the vibrational movement needed for the application. The resulting microfluidic channels have a near-circular cross-section, with a diameter up to 300m and a channel wall thickness of 1.5m. The structure of a micro-Coriolis mass-flow and density sensor is fabricated with this process as an example of a possible application.

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Improved HNA isotropic etching for large-scale highly symmetric toroidal silicon molds with <10-nm roughness

Cited by 4 publications

References 21 publications

Deep isotropic chemical etching (DICE) process for fabricating highly symmetric hemispherical silicon molds

Deep isotropic chemical etching (DICE) process for fabricating highly symmetric hemispherical silicon molds

Evolution of etch profile of <111> silicon in HNA solution

Fabrication of Buried Microchannels with Almost Circular Cross-Section Using HNA Wet Etching

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