Improved Numerical-Analytical Thermal Modeling Method of the PCB With Considering Radiation Heat Transfer and Calculation of Components’ Temperature

Zhang, Yabin

doi:10.1109/access.2021.3093098

Cited by 19 publications

(4 citation statements)

References 23 publications

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“…This also presents a simplified 2-D thermal resistance model to estimate the semiconductor junction temperature and the inductor temperature. An analytical method to estimate the PCB paths, case, and junction temperature of semiconductor switches is discussed in [26]. This method is based on Fourier series and finite volume techniques, with the main objective being to describe the thermal estimation of the PCB elements considering radiation heat transfer between the PCB and the ambient.…”

Section: Introductionmentioning

confidence: 99%

“…From methodologies employed in the literature, it is noted that works [23] and [24] lack an analysis of PCB paths and their impact on the junction temperature of semiconductors. [25] necessitates the implementation of a physical prototype, while [26] involves complex methods that are challenging to implement. Furthermore, [27] does not address the thermal behavior in PCBs with thermal vias, and [28] and [29] require FEA to extract thermal impedance among the elements.…”

Section: Introductionmentioning

confidence: 99%

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Analytical electro-thermal model and 3-D thermal resistance network for SMD-based printed circuit board power converters

Piovesan,

Prado,

Sartori

et al. 2024

Preprint

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This work presents an analytical electro-thermal model for SMD-based printed circuit board (PCB) power converters. Temperature-dependent component losses are derived from analytical models and a 3-D thermal resistance network is employed to characterize the temperatures across components and PCB paths. Furthermore, the work explores the mechanical and thermal interaction within the PCB paths, concurrently analyzing semiconductor switches and the power inductor in synchronous commutation cell configurations. The proposed model undergoes evaluation with two different PCB layouts of a synchronous boost converter, operating at 350 kHz with 50 W and 75 W. Model-generated temperatures are compared with experimental measurements using a thermal imaging camera and with Finite Elements Analysis (FEA) in Ansys Icepak. The acquired results validate the accuracy of the proposed model.

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Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Analytical electro-thermal model and 3-D thermal resistance network for SMD-based printed circuit board power converters

Piovesan,

Prado,

Sartori

et al. 2024

Preprint

View full text Add to dashboard Cite

show abstract

“…8,9 With the rapid development of 1 School of Mechanical Engineering, Hefei University of Technology, Hefei, China 2 computer technology in the past several decades, numerical methods (e.g. finite element method (FEM), 10,11 boundary element method (BEM), 12 finite volume method (FVM) 13 and finite difference method (FDM) 14 ) have become popular in the numerical simulation. However, contact calculations for complex rough surfaces are not feasible when using the FDM.…”

Section: Introductionmentioning

confidence: 99%

Numerical study on thermal-electrical-mechanical coupling mechanism of electrical connectors considering contact resistance

Feng

et al. 2023

Proceedings of the Institution of Mechanical Engineers, Part C:

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Electrical connectors are widely used in electromechanical equipment. Their rough surfaces inevitably induce electrical contact resistance (ECR) and thermal contact resistance (TCR), which generates a significant influence on electricity and heat conducting at the faying surface and affects the accuracy of the thermal-electrical-mechanical coupling (TEMC) numerical calculation. Thus, a TEMC model with ECR and TCR of a parallel groove clamp is necessary to investigate the TEMC mechanism. Firstly, appropriate ECR and TCR models are created based on the available experimental results. Secondly, a refined TEMC finite element model is established by optimising the mesh size at the faying surfaces, and the cyclic coupling calculation method is adopted to achieve efficient and consistent numerical calculations. Meanwhile, the validity of the simulation model is verified by experimental results. Finally, the transient real contact area, current density, and heat generation rate (HGR) are obtained to analyse the TEMC mechanism during temperature rise. The results indicate that the mechanical characteristics during temperature rise are different under two loading conditions of tight and loose, thereby resulting in different changing laws in terms of the maximum current density and HGR. In addition, two coupling mechanisms exist until the steady-state temperature is achieved.

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“…Printed circuit boards (PCBs) [1][2][3][4][5] are a mandatory part of most modern electronic devices. Furthermore, the upward trend of consumer electronics products and the increasing demands for industrial electronic equipment have promoted applications of the accuracy of PCBs assembly operation.…”

Section: Introductionmentioning

confidence: 99%

A real-time defect detection in printed circuit boards applying deep learning

Nguyen

Bui

2022

Eureka: PE

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Inspection of defects in the printed circuit boards (PCBs) has both safety and economic significance in the 4.0 industrial manufacturing. Nevertheless, it is still a challenging problem to be studied in-depth due to the complexity of the PCB layouts and the shrinking down tendency of the electronic component size. In this paper, a real-time automated supervision algorithm is proposed to test the PCBs quality among different scenarios. The density of the PCBs layout and the complexity on the surface are analyzed based on deep learning and image feature extraction algorithms. To be more detailed, the ORB feature and the Brute-force matching method are utilized to match perfectly the input images with the PCB templates. After transferring images by aiding the RANSAC algorithm, a hybrid method using modern computer vision algorithms is developed to segment defective areas on the PCBs surface. Then, by applying the enhanced Residual Network –50, the proposed algorithm can classify the groove defects on the surface mount technology electronic components which minimum size up to 1x3 mm. After the training process, the proposed system is capable to categorize various types of overproduced, recycled, and cloned PCBs. The speed of the quality testing operation maintains at a high level with an average precision rate up to 96.29 % in case of good brightness conditions. Finally, the computational experiments demonstrate that the proposed system based on deep learning can obtain superior results and it outperforms several existing works in terms of speed, precision, and robustness

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Improved Numerical-Analytical Thermal Modeling Method of the PCB With Considering Radiation Heat Transfer and Calculation of Components’ Temperature

Cited by 19 publications

References 23 publications

Analytical electro-thermal model and 3-D thermal resistance network for SMD-based printed circuit board power converters

Analytical electro-thermal model and 3-D thermal resistance network for SMD-based printed circuit board power converters

Numerical study on thermal-electrical-mechanical coupling mechanism of electrical connectors considering contact resistance

A real-time defect detection in printed circuit boards applying deep learning

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