Improved PCB via pattern to reduce crosstalk at package BGA region for high speed serial interface

Shim, Yujeong; Oh, Dan

doi:10.1109/ectc.2014.6897560

Cited by 12 publications

(5 citation statements)

References 3 publications

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“…Crosstalk is noise from capacitive and inductive couplings in adjacent channels [45][46][47]. Typically, the amount of far-and near-end crosstalk is proportional to the data rate and the number of aggressors.…”

Section: A Signal Noise: Crosstalkmentioning

confidence: 99%

Statistical Eye Diagrams for High-Speed Interconnects of Packages: A Review

Park,

Kim

2024

IEEE Access

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An eye diagram, a critical metric in signal integrity analysis for high-speed interconnects such as packages, interposer, and printed circuit boards (PCBs), is generated by superposition of the received waveform. Obtaining an eye diagram is time-consuming, thus signal integrity analysis is inefficient. This article reviews that have been proposed to overcome this limitation. The statistical eye diagram provides a probability distribution depending on a sampling time and voltage, therefore it can be expanded to other metrics, such as the bit-error rate and shmoo plot. This article introduces previous research on statistical eye diagrams applied to complementary metal-oxide-semiconductors (CMOSs), noise, and high-speed systems. The methods applied to CMOSs include asymmetry between the P/NMOS transistors and the nonlinearity of the CMOS. The methods applied to noise include signal and power noise. The methods applied to high-speed systems include equalizers, signaling, encoding, linear feedback shift register, and error correction code.INDEX TERMS Complementary metal-oxide-semiconductor (CMOS), crosstalk, double edge response (DER), error correction code (ECC), encoding, equalizer, eye diagram, multiple edge response (MER), pulse amplitude modulation (PAM), package, single bit response (SBR), signal integrity (SI), statistical eye diagram.

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Section: A Signal Noise: Crosstalkmentioning

confidence: 99%

Statistical Eye Diagrams for High-Speed Interconnects of Packages: A Review

Park,

Kim

2024

IEEE Access

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“…The coupling effect occurred before PAs is called the nonlinear crosstalk, which may be introduced from the leakage of RF signal via the common local oscillator (LO) and/or also from the limited isolation between the different physical channels [5], [7], [8]. Fig.…”

Section: A Crosstalk In Mimo Transmittersmentioning

confidence: 99%

“…For MIMO transmitters, multiple radio-frequency (RF) channels are often integrated into one single compact chip to improve the integration and reduce the size of the transmitter. However, it inevitably introduces crosstalk (also known as the coupling effect) between different physical channels [5]- [8], given the channel isolation is limited by the size of the transmitter. Some of the crosstalk can be equivalently regarded as part of the multipath effects and can be compensated at the receiver side of the MIMO link.…”

Section: Introductionmentioning

confidence: 99%

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Digital Predistortion for MIMO Transmitters Using Multi-Channel Error Feedback Adaptation

Liu

Zhang²,

Xia

et al. 2020

IEEE Access

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“…The frequency selective surface (FSS), which comprises an array of periodic elements, is also an effective approach for the EMI shielding [11,12]. Some unique techniques, such as subwavelength periodic corrugated metal strip lines, stubs loaded lines [13][14][15] and improved ball grid array (BGA) pattern [16] were proposed to reduce the crosstalk between the signal strips. The carbon nanotube with the remarkable physical and electrical properties also has the potential for shielding structures [17].…”

Section: Introductionmentioning

confidence: 99%

Novel planar quasi‐TEM transmission line with high isolation and its application to T‐junction power divider

Guo

Xia

et al. 2020

IET Microwaves, Antennas & Propagation

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In this study, a novel quasi‐transverse electromagnetic (TEM) transmission line (TL) on a single‐layer substrate is presented. The proposed structure comprises bilateral metalised vias and two longitudinal slots on the top and bottom plates, respectively. This two‐conductor TL separated by the two slots allows the quasi‐TEM mode and guarantees high isolation due to the vias which constrain the electromagnetic field. Additionally, the proposed structure provides a remarkable high range of the characteristic impedance, enabling a more flexible design. Furthermore, an empirical analytical formula is derived to calculate the characteristic impedance of the proposed TL adopting conformal mapping, and modified by a polynomial fraction. The transitions to the double‐sided parallel‐strip line and the microstrip line are proposed with which the propagation constant of this TL is extracted. The comparisons of the far‐end couplings of several types of microwave TLs have been provided by the simulation and measurement to verify the isolation property of the proposed TL. Finally, the proposed TL is applied to the T‐junction wideband power divider design to demonstrate its practicability. A prototype is fabricated and measured with a wide operating bandwidth from 6.8 to 17.6 GHz.

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Improved PCB via pattern to reduce crosstalk at package BGA region for high speed serial interface

Cited by 12 publications

References 3 publications

Statistical Eye Diagrams for High-Speed Interconnects of Packages: A Review

Statistical Eye Diagrams for High-Speed Interconnects of Packages: A Review

Digital Predistortion for MIMO Transmitters Using Multi-Channel Error Feedback Adaptation

Novel planar quasi‐TEM transmission line with high isolation and its application to T‐junction power divider

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