2012 IEEE 62nd Electronic Components and Technology Conference 2012
DOI: 10.1109/ectc.2012.6248879
|View full text |Cite
|
Sign up to set email alerts
|

Improved predictions of lead free solder joint reliability that include aging effects

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
4
1

Citation Types

0
16
0

Year Published

2013
2013
2024
2024

Publication Types

Select...
4
3
1

Relationship

3
5

Authors

Journals

citations
Cited by 93 publications
(16 citation statements)
references
References 18 publications
0
16
0
Order By: Relevance
“…There is a little or no data available in published literature for commonly used SAC105 and SAC305 solder alloys in the strain rate range 1-100 sec -1 . Extended period of thermal aging has been shown to affect the mechanical properties of leadfree alloys including elastic modulus and the ultimate tensile strength at low strain rates representative of thermal fatigue [Lee 2012, Motalab 2012]. Evolution of mechanical properties of leadfree alloys has been shown to be prevalent even at room temperature [Zhang 2009].…”
Section: Introductionmentioning
confidence: 99%
“…There is a little or no data available in published literature for commonly used SAC105 and SAC305 solder alloys in the strain rate range 1-100 sec -1 . Extended period of thermal aging has been shown to affect the mechanical properties of leadfree alloys including elastic modulus and the ultimate tensile strength at low strain rates representative of thermal fatigue [Lee 2012, Motalab 2012]. Evolution of mechanical properties of leadfree alloys has been shown to be prevalent even at room temperature [Zhang 2009].…”
Section: Introductionmentioning
confidence: 99%
“…Aging was included by using different values of the 9 Anand model parameters for the various prior aging conditions (reflecting the different initial microstructures prior to thermal cycling). Determination of the aging dependence of the Anand parameters has been discussed in detail in prior work of the authors [7][8]24]. The parameters used in this work for no aging, and 6 and 12 months of prior aging at 125 o C are tabulated in Figure 12.…”
Section: Materials Behavior Modelsmentioning
confidence: 99%
“…Thus, there will be significant errors in the calculations with lead free SAC alloys that illustrate dramatic aging phenomena. In recent studies [24][25], we have developed a framework for correcting this limitation and including aging effects in the reliability modeling. The developed approach involved the use of: (1) a revised set off Anand viscoplastic stress-strain relations for solder that included material parameters that evolve with the thermal history of the solder material, and (2) a revised solder joint failure criterion that included aging effects.…”
Section: Introductionmentioning
confidence: 99%
“…Zhang and coworkers [9][10] have shown that large reductions in the thermal cycling reliability of BGA test assemblies occurs when they are subjected to aging prior to accelerated life testing. Motalab, et al [11][12][13] have included aging effects in the Anand constitutive model and energy density based failure criterion for SAC solders, and then used these theories with finite element analyses to predict the thermal cycling life of aged BGA assemblies. Good correlations were achieved with the measured lifetimes from references [9][10].…”
Section: Introductionmentioning
confidence: 99%
“…Aging effects on the constitutive and failure behaviors of lead free solders have been studied extensively by the authors and their coworkers [2][3][4][5][6][7][8][9][10][11][12][13][14]. In early investigations, the mechanical properties and creep behavior of SAC alloys were shown to be severely degraded by prior exposure to room temperature (25 C) and elevated temperature (50, 75, 100, and 125 C) aging [2][3][4][5][6].…”
Section: Introductionmentioning
confidence: 99%