2023
DOI: 10.1016/j.microrel.2023.115257
|View full text |Cite
|
Sign up to set email alerts
|

Improved reliability of a-IGZO thin-film transistor under positive gate bias stress by utilizing NH3 plasma treatment

Wangran Wu,
Wenting Xu,
Hao Tian
et al.
Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1

Citation Types

0
1
0

Year Published

2024
2024
2025
2025

Publication Types

Select...
1
1

Relationship

0
2

Authors

Journals

citations
Cited by 2 publications
(1 citation statement)
references
References 25 publications
0
1
0
Order By: Relevance
“…4 indicates that the concentration of pre-existing VO in the a-IGZO is relatively small [33]. When the electrons generated after ionization of pre-existing VO drift further toward the back surface of the a-IGZO under the negative gate bias, those electrons with high energy may break weak metal-oxygen bonds, thereby simultaneously triggering the generation of Oi and VO as Frenkel defects [34,35]. Ionization of the newly generated VO further increases SS and the generated Oi increases Vth of the a-IGZO TFT, which is consistent with simultaneous occurrence of increase of SS and Vth in the second degradation stage as shown in Fig.…”
Section: Resultsmentioning
confidence: 99%
“…4 indicates that the concentration of pre-existing VO in the a-IGZO is relatively small [33]. When the electrons generated after ionization of pre-existing VO drift further toward the back surface of the a-IGZO under the negative gate bias, those electrons with high energy may break weak metal-oxygen bonds, thereby simultaneously triggering the generation of Oi and VO as Frenkel defects [34,35]. Ionization of the newly generated VO further increases SS and the generated Oi increases Vth of the a-IGZO TFT, which is consistent with simultaneous occurrence of increase of SS and Vth in the second degradation stage as shown in Fig.…”
Section: Resultsmentioning
confidence: 99%