Improved RF Isolation Using Carbon Nanotube Fence-Wall for 3-D Integrated Circuits and Packaging

Tan, Dunlin; Yu, Jong Jen; Hee, David; Lim, Hock Siong; Baillargeat, Dominique; Eudeline, Philippe; Tay, Beng Kang

doi:10.1109/lmwc.2015.2425546

Cited by 12 publications

(8 citation statements)

References 16 publications

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“…Figure 6 -6 illustrates the SEM images of both pre-deposited and floating catalystgrown CNT films. From these images, one can clearly observe that CNTs grown by both catalyst sources displayed high degree of vertical alignment, which is in agreement with prior studies that reported on CNT growth using pre-deposited [152] and floating [127] catalyst sources. In fact, the vertical alignment of the pre-deposited catalyst-grown CNTs could be attributed to the 'crowding effect' between the CNTs [144], as mentioned earlier.…”

Section: Resultssupporting

confidence: 90%

Development of carbon nanotubes for vacuum electronics application

Lim¹

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First and foremost, I would like to express my deepest appreciation to my PhD supervisor, Professor Tay Beng Kang. His continuous support and guidance are highly appreciated. He has groomed and trained me, not only in the area of research, but also in working well with collaborators and other important professional aspects. I have learned a lot from him throughout this PhD study. On top of that, I would like to acknowledge the financial supports on my research project from the Economic Development Board (EDB) under the project S14-1126-NRF OSTIn-SRP; and COE Research Grant under the project M4081666. At the same time, I would also like to express my gratitude to Nanyang Technology University for the kind opportunity to receive this offer of PhD study with fully-funded scholarship. I would also like to express my appreciations to my co-supervisor, Associate Professor Sheel Aditya, for his endless guidance, especially on the areas of device simulation and manuscript writing. At the same time, I would also like to thank my TAC members, Associate Professor Miao Jianmin and Associate Professor Daniel Chua and their respective students in providing their expertise guidance and support on microfabrication and field emission measurement. My gratitude also goes to the project's external collaborator, Professor Vladimir Labunov from Belarusian State University of Informatics and Radioelectronics, for his support on the microfabrication and Carbon Nanotubes growth. Next, I would also like to thank Professor Yan Xingbin from Lanzhou Institute of Chemical Physics (Chinese Academy of Science), for his support on the synthesis and fabrication of high current density Carbon Nanotubes field emitter. iv I would also like to express my gratitude to my project members, Dr Xia Xin, Dr Wang Shaomeng, and Mr Zishan Ali; and my fellow colleagues for their kind support in various aspects in my PhD research. Last but not least, I would like to thank my family in Malaysia, who constantly provide moral supports whenever I face difficulties and bottlenecks in my research life. To my late father, thank you for everything that you have given to me. You are proud of me, I know it.

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Section: Resultssupporting

confidence: 90%

Development of carbon nanotubes for vacuum electronics application

Lim¹

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“…The demand to compact more electrical components within a miniaturised integrated circuit (IC) has been continuously increasing over the years. The densely packed ICs produce severe electromagnetic interference (EMI) which could potentially cause detriment or even failure to the device if they are not well shielded [1]. To reduce the EMI, EMI shields are added into ICs to reduce and eliminate the disruption caused by electromagnetic (EM) radiation.…”

Section: Introductionmentioning

confidence: 99%

Boron Nitride Coated Three-Dimensional Graphene as an Electrically Insulating Electromagnetic Interference Shield

Ngoh

Leong

Tay

et al. 2019

2019 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-A

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We demonstrate the potential of a novel hybrid nanostructure three-dimensional graphene (3D-C) coated with boron nitride (BN) as an electromagnetic interference (EMI) shield. BN, deposited by sputtering, encapsulates 3D-C to form a light-weight graphene based EM shield that has an electrically insulating exterior. The BN deposited on 3D-C was homogeneously distributed with even coverage on the struts of 3D-C. EMI shielding results have shown that the hybrid material has a total shielding effectiveness (SET) of 53dB and 58dB in the X band and Ku band respectively.

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“…Since the SAC reflow step is performed below 250 °C, the transfer method developed using SAC is CMOS-compatible. Improvements in the CNT transfer technique will uncover opportunities in the commercial applications of CNTs, such as interconnects [ 4 ], thermal management [ 5 ], field-emission [ 6 ], and on-board electromagnetic shielding [ 7 ].…”

Section: Discussionmentioning

confidence: 99%

“…In the past few decades, carbon nanotubes (CNTs) have stimulated a large interest in the research world for their material properties. The discovery of their extraordinary mechanical [ 1 ], electrical [ 2 ], and thermal [ 3 ] properties prophesized CNTs as the next revolutionary material in numerous applications such as interconnect [ 4 ], thermal management [ 5 ], field-emission [ 6 ], and on-board electromagnetic shielding [ 7 ].…”

Section: Introductionmentioning

confidence: 99%

Development of a CMOS-Compatible Carbon Nanotube Array Transfer Method

Siah

Lum

Wang³

et al. 2021

Micromachines

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Carbon nanotubes (CNTs) have, over the years, been used in research as a promising material in electronics as a thermal interface material and as interconnects amongst other applications. However, there exist several issues preventing the widespread integration of CNTs onto device applications, e.g., high growth temperature and interfacial resistance. To overcome these issues, a complementary metal oxide semiconductor (CMOS)-compatible CNT array transfer method that electrically connects the CNT arrays to target device substrates was developed. The method separates the CNT growth and preparation steps from the target substrate. Utilizing an alignment tool with the capabilities of thermocompression enables a highly accurate transfer of CNT arrays onto designated areas with desired patterns. With this transfer process as a starting point, improvement pointers are also discussed in this paper to further improve the quality of the transferred CNTs.

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Improved RF Isolation Using Carbon Nanotube Fence-Wall for 3-D Integrated Circuits and Packaging

Cited by 12 publications

References 16 publications

Development of carbon nanotubes for vacuum electronics application

Development of carbon nanotubes for vacuum electronics application

Boron Nitride Coated Three-Dimensional Graphene as an Electrically Insulating Electromagnetic Interference Shield

Development of a CMOS-Compatible Carbon Nanotube Array Transfer Method

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