2008
DOI: 10.1016/j.tsf.2007.11.016
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Improved stability of titanium based boron-doped chemical vapor deposited diamond thin-film electrode by modifying titanium substrate surface

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Cited by 35 publications
(13 citation statements)
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“…Nevertheless, fabrication of BDD on a Ti substrate requires long cooling time at the end of the CVD process because of the large thermal expansion gap and because of the problem of poorer long-term stability compared to that of Si-based BDDs, which results in delamination of the diamond lm from the substrate due to residual stress. 7,31 Moreover, the porous BDD of He et al is limited to microsized structures, leaving the corresponding nanostructures, which are expected to exhibit substantially greater surface areas, unexplored.…”
Section: Introductionmentioning
confidence: 99%
“…Nevertheless, fabrication of BDD on a Ti substrate requires long cooling time at the end of the CVD process because of the large thermal expansion gap and because of the problem of poorer long-term stability compared to that of Si-based BDDs, which results in delamination of the diamond lm from the substrate due to residual stress. 7,31 Moreover, the porous BDD of He et al is limited to microsized structures, leaving the corresponding nanostructures, which are expected to exhibit substantially greater surface areas, unexplored.…”
Section: Introductionmentioning
confidence: 99%
“…It was found that the surface roughness of the substrate was a key factor that determined the adhesion of the BD-UNCD film. A roughened substrate surface reduces the thermal stress within the BD-UNCD film and improves film adhesion to the substrate [13]. BD-UNCD films showed no visual signs of delamination on the roughed substrates except Ti.…”
Section: Electrode Stability Testsmentioning
confidence: 98%
“…7 Electrode R s (X cm 2 ) R ct (X cm 2 ) CPE dl (lF cm -2 s n-1 ) n dl R p (X cm 2 ) CPE p (mF cm -2 s n-1 ) n p delamination. Additionally, roughening the substrate by a bead blast method can result in greater adhesion, because of increasing the density of nucleation sites for the BD-UNCD film and reducing the overall film stress [13]. Although film delamination did not occur for the BD-UNCD/Si electrode, both the physical and electrochemical characteristics changed as a function of anodic oxidation.…”
Section: Proposed Mechanisms Of Electrode Wearmentioning
confidence: 99%
“…Industrial effluents contain a wide variety of pollutants, including biorefractory organic compounds which resist conventional treatment techniques and are harmful to the environment and human beings [ 1 , 2 ]. Recent research has shown that boron-doped diamond anode (BDD) electrochemical technique can offer a good opportunity to prevent and remedy pollution problems [ 3 , 4 ].The electrochemical properties of BDD deposited on Si, Ti, Ta substrate have been reported [5,6,7]. However, friable Si and expensive Ta are not suitable to commercial manufacture.…”
Section: Introductionmentioning
confidence: 99%
“…However, friable Si and expensive Ta are not suitable to commercial manufacture. Ti is an attractive substrate material for the BDD film electrodes due to the compromise between material cost, corrosion and mechanical stability [6]. On the other hand, the porous and loose TiC between the interface of Ti substrate and BDD leads to the adhesion decreasing.…”
Section: Introductionmentioning
confidence: 99%