“…Cu intercalation in n-type Bi 2 (Te, Se) 3 alloys have been discovered to be a particularly efficient method for lowering the lattice thermal conductivity by adding more point defect scattering centers. The quantum confinement effect and lower k tot of low-dimensional materials compared to bulk materials with better thermoelectric efficiency at an absolute temperature have reignited interest in TE materials [14,[19][20][21]. Several dopants like Se, Sb, Cu, Mg, Cl, Ti, Ca, Pd, S, In, etc have been used for improving the thermoelectric efficiency [22][23][24][25][26][27].…”