Improved understanding of the enhancement of sintering of mixtures of Cu microparticles and sn nanoparticles for electronic packaging

Yang, Guannan; Lin, Wei; Lai, Haiqi; Zhong, Chaobin; Cui, Chengqiang

doi:10.1007/s10854-022-08119-7

Cited by 2 publications

(2 citation statements)

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“…Cupric oxides have a higher melting point and resistivity than pure Cu, which hinders the formation of sintering necks between Cu particles, resulting in poor sintering properties and low conductivity [8][9][10]. The method of fabricating Cu nanoparticles with strong oxidation resistance has become a crucial question for their application in electronics manufacturing [11][12][13].…”

Section: Introductionmentioning

confidence: 99%

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Synthesis of Imidazole-Compound-Coated Copper Nanoparticles with Promising Antioxidant and Sintering Properties

Zhang,

Yu,

Chen

et al. 2023

Micromachines

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In this study, we present a facile method for preparing oxidation-resistant Cu nanoparticles through a liquid-phase reduction with imidazole compounds (imidazole, 2-methylimidazole, 2-phenylimidazole, and benzimidazole) that serve as protective and dispersing agents. Through a complexation reaction between Cu atoms, the imidazole compounds can form a protective film on the Cu nanoparticles to prevent the particles from rapidly oxidizing. We compared the effects of the four kinds of imidazole compounds on the oxidation resistance and sintering properties of Cu particles. The Cu particles prepared with benzimidazole could be stored in the air for 30 days without being oxidized. After sintering at 300 °C and 2 MPa, the joint of the particles could reach a shear strength of 32 MPa, which meets the requirements for microelectronic packaging.

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Section: Introductionmentioning

confidence: 99%

“…Inorganic coating treatments use inorganic elements, such as silver [19,20], phosphorus [21], and tin [13], to form a compact protective film on the Cu particles. For example, in a study by Dai et al, cupric formate was heated to 170 • C in an oleylamine solution and was decomposed to form Cu nanoparticles [22].…”

Section: Introductionmentioning

confidence: 99%