Improvement in Adhesion of Cu/glass Stacks using ZnO Thin Films Deposited by Chemical Solution Methods and Its Formation Conditions

Abstract

塗布法によって堆積した ZnO 薄膜を用いた Cu / ガラス構造の密着性向上ならびにその形成条件の検討 渡邉 満洋 a,* ，小池 光海 b ，近藤 英一 a a 山梨大学 大学院総合研究部 (〒 400-8511 山梨県甲府市武田 4-3-11) b 山梨大学 工学部 (〒 400-8511 山梨県甲府市武田 4-3-11)After zinc oxide (ZnO) thin films were deposited using chemical solution methods such as sol-gel method and metal organic decomposition, the deposited ZnO thin films were used as a precursor promoting adhesion in Cu/glass stack systems. Transparent ZnO thin films were deposited on a borosilicate glass substrate using chemical solution methods. X-ray diffraction and X-ray photoelectron spectroscopy analyses revealed that the deposited ZnO thin films have no specified orientation and much less carbon contamination. The obtained ZnO thin films comprised two characteristic layers: a porous structure formed at the glass substrate side and a dense layer formed at the surface side. The adhesion of Cu/glass stacks formed by the ZnO thin films increased markedly when the ZnO/glass stacks were annealed at 600 ℃. Furthermore, the adhesion increased with increasing ZnO removal time, reaching a maximum value at a certain removal time, but decreasing thereafter. These results indicate that the deposited ZnO thin films are effective for the improvement of Cu/glass stack adhesion. Results show that a Zn-doped layer formed at the glass surface plays an important role in the improvement of Cu/glass stack adhesion.

Room-Temperature Formation of Intermixing Layer for Adhesion Improvement of Cu/Glass Stacks

“…It is found that this adhesion enhancement is not influenced by the kind of glass substrate. The influence of the kind of ZnO layer on adhesion strength was examined [30,31]. ZnO layer was fabricated by sol-gel method, metal organic decomposition (MOD), and supercritical fluid chemical deposition (SFCD), and we investigated whether these ZnO layers improve the adhesion of Cu/glass stacks.…”