2015
DOI: 10.1016/j.jallcom.2015.02.024
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Improvement in strength and thermal conductivity of powder metallurgy produced Cu–Ni–Si–Cr alloy by adjusting Ni/Si weight ratio and hot forging

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Cited by 32 publications
(10 citation statements)
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“…These results are consistent with the basic principles of copper alloy design based on metallurgy. 37,38 On the other side, when the content of strengthening elements such as Ni, Si, and Cr increases significantly, the EC of copper alloys will inevitably be adversely affected. To solve this contradiction, the scheme recommended by MLDS is to increase the concentration of P element, as the trace P element can purify the matrix and promote the precipitation of the second phase of Cu-Ni-Si alloys, which is beneficial to improving the EC of Cu-Ni-Si alloys.…”
Section: Construction and Application Of A Property-oriented Mldsmentioning
confidence: 99%
“…These results are consistent with the basic principles of copper alloy design based on metallurgy. 37,38 On the other side, when the content of strengthening elements such as Ni, Si, and Cr increases significantly, the EC of copper alloys will inevitably be adversely affected. To solve this contradiction, the scheme recommended by MLDS is to increase the concentration of P element, as the trace P element can purify the matrix and promote the precipitation of the second phase of Cu-Ni-Si alloys, which is beneficial to improving the EC of Cu-Ni-Si alloys.…”
Section: Construction and Application Of A Property-oriented Mldsmentioning
confidence: 99%
“…Comparison of tensile strength and electrical conductivity of high-strength copper alloys. ( a ) Cu-Ni-Si systems alloys and other copper alloys [34,35,36,37,38,39,40,41,42,43,44,45,46,47,48,49,50,51] and ( b ) the designed alloy and other Cu-Ni-Si-X alloys [1,2,3,4,52,53,54,55,56,57,58,59]. …”
Section: Figurementioning
confidence: 99%
“…Cu-Ni-Si alloys are widely used in electrical applications because of their high strength, excellent electric conductivity, and good anti-stress relaxation properties [1]. For the last few decades, the microstructure of the alloy has been developed by adjusting the Ni/Si ratio and optimizing the heat treatment process to further enhance the properties of the alloy [2]. Up to now, the pure ternary Cu-Ni-Si alloys has exhibited a high strength of 600–800 MPa and an electrical conductivity of 30%–45% IACS [3], but these values seem to reach the limits of ternary alloys.…”
Section: Introductionmentioning
confidence: 99%