Extended Abstracts of the 2007 International Conference on Solid State Devices and Materials 2007
DOI: 10.7567/ssdm.2007.c-8-2
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Improvement of Adhesion at the Interface between Low-k Spin-on Dielectric and underlying SiCO Barrier by Plasma Treatments

Yasuo Takigawa1,
Shin-ichi Nakao2,
Morio Shiohara3
et al.
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