“…The microfluidic devices were fabricated following previously reported procedure, with some modifications. − The devices comprised an injection unit, an LC unit (PA column) with a low dispersion turn (Table S1), and a postcolumn derivatization unit (hollow-channel, 5-μm PA, or 10-μm PA mixers). The devices were fabricated on 20 × 20 mm silicon chips via multistep ultraviolet photolithography (MA-6, SUSS MicroTec, Germany) and deep reactive ion etching (RIE-400iPH, Samco Inc., Kyoto, Japan) with anodic bonding (Techno System, Kanagawa, Japan) to a glass plate.…”