2017 IEEE 67th Electronic Components and Technology Conference (ECTC) 2017
DOI: 10.1109/ectc.2017.47
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Improvement of C2W Collective Bonding Reliability and UPH through Innovations in Machine, Materials and Methods

Tomonori Nakamura1,
Farhan Shafiq2,
Tetsuya Otani3
et al.
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Cited by 10 publications
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References 7 publications
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Design and Application of Innovative Multi-table and Bond Head Drive System on Thermal Compression Bonder with UPH Over 2000

Seyama
1
,
Wada
2
,
Eguchi
3
et al. 2018
2018 IEEE 68th Electronic Components and Technology Conference (ECTC)
6
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0
0
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Design and Application of Innovative Multi-table and Bond Head Drive System on Thermal Compression Bonder with UPH Over 2000

Seyama
1
,
Wada
2
,
Eguchi
3
et al. 2018
2018 IEEE 68th Electronic Components and Technology Conference (ECTC)
6
0
0
0
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Enhanced Performance of Laser-Assisted Bonding with Compression (LABC) Compared with Thermal Compression Bonding (TCB) Technology

Choi
1
,
Eom
2
,
Moon
3
et al. 2019
2019 IEEE 69th Electronic Components and Technology Conference (ECTC)
18
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2
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Development of simultaneous transferring and bonding (SITRAB) process for µLED arrays using Anisotropic Solder Paste (ASP) and Laser-Assisted Bonding (LAB) Technology

Joo
1
,
Lee
2
,
Kye
3
et al. 2021
2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
2
0
0
0
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