Improvement of microstructure and tensile properties of Sn–Bi–Ag alloy by heterogeneous nucleation of β-Sn on Ag3Sn

Yang, Tianqi; Zhao, Xiuchen; Xiong, Zishan; Tan, Wei; Wei, Ying; Tan, Chengwen; Yu, Xinquan; Wang, Yingchun

doi:10.1016/j.msea.2020.139372

Cited by 31 publications

(14 citation statements)

References 29 publications

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“…In addition, in the solder alloy with Cu added, the originally thick Zn-rich phase was also broken and disappeared, and then the eutectic Zn phase with fine needle shape and uniform distribution appeared, which could also play a similar effect of dispersion strengthening on the matrix [ 3 ]. The improvement in strength by dispersion strengthening can be approximated as [ 32 , 33 ]. σ = Gb/λ where σ is the yield stress (MPa), G is the shear modulus of the material matrix (Pa), b is Burgers vector (nm) and λ refers to the distance between the dispersed particles (μm).…”

Section: Resultsmentioning

confidence: 99%

Effect of Cu Content on Performance of Sn-Zn-Cu Lead-Free Solder Alloys Designed by Cluster-Plus-Glue-Atom Model

et al. 2021

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The mechanical properties of solder alloys are a performance that cannot be ignored in the field of electronic packaging. In the present study, novel Sn-Zn solder alloys were designed by the cluster-plus-glue-atom (CPGA) model. The effect of copper (Cu) addition on the microstructure, tensile properties, wettability, interfacial characterization and melting behavior of the Sn-Zn-Cu solder alloys were investigated. The Sn29Zn4.6Cu0.4 solder alloy exhibited a fine microstructure, but the excessive substitution of the Cu atoms in the CPGA model resulted in extremely coarse intermetallic compound (IMC). The tensile tests revealed that with the increase in Cu content, the tensile strength of the solder alloy first increased and then slightly decreased, while its elongation increased slightly first and then decreased slightly. The tensile strength of the Sn29Zn4.6Cu0.4 solder alloy reached 95.3 MPa, which was 57% higher than the plain Sn-Zn solder alloy, which is attributed to the fine microstructure and second phase strengthening. The spreadability property analysis indicated that the wettability of the Sn-Zn-Cu solder alloys firstly increased and then decreased with the increase in Cu content. The spreading area of the Sn29Zn0.6Cu0.4 solder alloy was increased by 27.8% compared to that of the plain Sn-Zn solder due to Cu consuming excessive free state Zn. With the increase in Cu content, the thickness of the IMC layer decreased owing to Cu diminishing the diffusion force of Zn element to the interface.

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Section: Resultsmentioning

confidence: 99%

Effect of Cu Content on Performance of Sn-Zn-Cu Lead-Free Solder Alloys Designed by Cluster-Plus-Glue-Atom Model

et al. 2021

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“…Sn-38Bi-1.0Ag (Ribas et al , 2017) and Sn-57.6 Bi-0.4Ag (Ribas et al , 2017) recorded the highest ultimate tensile strength and elongation, respectively. Sn-58Bi-3.0Ag (Yang et al , 2020) and Sn-57Bi-0.6Ag (Silva et al , 2017) recorded the lowest ultimate tensile strength and elongation, respectively. Similarly, when different weight percentages of Zn were added to the Sn-Bi based solder, Sn-45Bi-2.61Zn (Zhou et al , 2019b), Sn-58Bi-0.5Zn (Zhou et al , 2018) and Sn-58Bi-1.0Zn (Zhou et al , 2018), the solders were not very different in their ultimate tensile strengths; they were all in the range of 50–53 MPa.…”

Section: Tensile Propertiesmentioning

confidence: 98%

“…Both tensile test specimens had the same thickness but different shapesdogbone shape and solder slab. Chen et al (2016) and Yang et al (2020) tested the tensile properties of Sn-58Bi under the same strain rate of 1 Â 10 À2 s À1 . The ultimate tensile strengths in the two studies were 95 MPa and 60 MPa, respectively.…”

Section: Tensile Propertiesmentioning

confidence: 99%

“…Chen et al (2016) and Yang et al (2020) tested the tensile properties of Sn-58Bi under the same strain rate of 1 × 10 −2 s −1 . The ultimate tensile strengths in the two studies were 95 MPa and 60 MPa, respectively.…”

Section: Tensile Propertiesmentioning

confidence: 99%

“…Silva et al (2017); Ribas et al (2017); and Yang et al (2020) reported the tensile properties of Sn-Bi solder with the addition of Ag. The 1.0 wt.…”

Section: Tensile Propertiesmentioning

confidence: 99%

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Effects of alloying element on mechanical properties of Sn-Bi solder alloys: a review

Kamaruzzaman

Goh

2022

SSMT

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Purpose This paper aims to review recent reports on mechanical properties of Sn-Bi and Sn-Bi-X solders (where X is an additional alloying element), in terms of the tensile properties, hardness and shear strength. Then, the effects of alloying in Sn-Bi solder are compared in terms of the discussed mechanical properties. The fracture morphologies of tensile shear tested solders are also reviewed to correlate the microstructural changes with mechanical properties of Sn-Bi-X solder alloys. Design/methodology/approach A brief introduction on Sn-Bi solder and reasons to enhance the mechanical properties of Sn-Bi solder. The latest reports on Sn-Bi and Sn-Bi-X solders are combined in the form of tables and figures for each section. The presented data are discussed by comparing the testing method, technical setup, specimen dimension and alloying element weight percentage, which affect the mechanical properties of Sn-Bi solder. Findings The addition of alloying elements could enhance the tensile properties, hardness and/or shear strength of Sn-Bi solder for low-temperature solder application. Different weight percentage alloying elements affect differently on Sn-Bi solder mechanical properties. Originality/value This paper provides a compilation of latest report on tensile properties, hardness, shear strength and deformation of Sn-Bi and Sn-Bi-X solders and the latest trends and in-depth understanding of the effect of alloying elements in Sn-Bi solder mechanical properties.

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Evolution of microstructure and physical properties of lead-free Sn–5Sb-Ag rapidly solidified solder alloys

2021

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Improvement of microstructure and tensile properties of Sn–Bi–Ag alloy by heterogeneous nucleation of β-Sn on Ag3Sn

Cited by 31 publications

References 29 publications

Effect of Cu Content on Performance of Sn-Zn-Cu Lead-Free Solder Alloys Designed by Cluster-Plus-Glue-Atom Model

Effect of Cu Content on Performance of Sn-Zn-Cu Lead-Free Solder Alloys Designed by Cluster-Plus-Glue-Atom Model

Effects of alloying element on mechanical properties of Sn-Bi solder alloys: a review

Evolution of microstructure and physical properties of lead-free Sn–5Sb-Ag rapidly solidified solder alloys

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