The evaluation and structural optimization of a family of single layer, positive tone,
chemically amplified resists for 193-nm lithography is presented. The resists are formulated
from cyclopolymeric materials in which the nature, etch properties, and spatial disposition
of the substituents are systematically varied. Their lithographic performance is evaluated
on the basis of the interplay between chemical structure, molecular weight, and comonomer
composition. These materials have good optical clarity at the desired wavelength, excellent
resolution to ca. 90 nm with a phase-shifting mask, and outstanding reactive ion etch
resistance.