Boron and phosphorus passivation in silicon metal-oxide-semiconductor (MOS) capacitors under x-ray irradiation follows a power law in the form N/N 0 ∼ (dose) α , with 1 2 α 1, depending on processing parameters and the device history before irradiation. The minimum x-ray dose for observation of dopant passivation in fluorinated p-type MOS capacitors is smaller when the time interval between fabrication and subsequent irradiation increases. We reason that room-temperature ageing within this timescale is a result of either adsorption of water or gradual reactions of fluorine with hydrogen, silicon or oxygen-related species in the neighbourhood of the SiO 2 /Si interface.