Improvement of TEOS-chemical mechanical polishing performance by control of slurry temperature

Kim, Nam–Hoon; Ko, Pil Ju; Seo, Yong-Jin; Lee, Woo-Sun

doi:10.1016/j.mee.2005.08.011

Cited by 17 publications

(14 citation statements)

References 25 publications

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“…[23,24]. The peak at 533.18-533.50 eV originates from the Si-O-Si groups [25,26], the peak at 532.62-532.93 eV originates from the Si-OH groups [27], while the peak at 532.31-532.46 eV originates from the Si-OC 2 H 5 groups [28].…”

Section: Characterizationmentioning

confidence: 99%

A study of morphological properties of SiO2 aerogels obtained at different temperatures

Liao

Gao

et al. 2018

J Adv Ceram

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In this paper, temperature dependence of nanoporous framework evolution process and variety of pore properties (pore volume, specific surface area (BET), and pore size) of SiO 2 aerogels were characterized by FTIR, XPS, XRD, SEM, TEM, BET, BJH, etc. Results show that SiO 2 aerogels treated at different temperatures all possess amorphous structure. With the increase of treated temperatures, BET values of SiO 2 aerogels increase initially and then decrease, and it reaches the maximum value of 882.81 m 2 /g when treated at 600 ℃ for 2 h due to the addition of the nanopores and shrinkage skeleton of SiO 2 aerogels. Higher temperatures may result in a framework transformation and particle growth; both factors could reduce the BET values of the aerogels. Nanoporous skeleton of SiO 2 aerogels at room temperatures is composed of tetrahedron with a pore size of about 22.28 nm. Higher treated temperatures result in an increase of octahedron amount in nanoporous framework and a decrease of pore size. When treated at 1000 ℃, an approximate dense SiO 2 bulk via the framework collapse and particle growth is obtained. These varieties are derived from the formed extra bonds of Si-O-Si, higher local stress, and liquid phase between particles during heat treatment process.

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Section: Characterizationmentioning

confidence: 99%

A study of morphological properties of SiO2 aerogels obtained at different temperatures

Liao

Gao

et al. 2018

J Adv Ceram

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“…Also, in some cases, chemical reactions like the Fenton reaction are spontaneous exothermic processes, contribute to temperature increase during polishing. (ii) Case II: As is well known, with increasing temperature of the system, the rates of chemical reactions increase [118], leading to higher removal rates [116,119,120]. Kim et al reported that the slurries at higher temperatures lead to the formation of the soft layers on the surface of SiO 2 film, and this layer could be easily removed by mechanical abrasion [116,119].…”

Section: The Effect Of Temperature Changes On the Chemical And Mechanical Reactions During Polishingmentioning

confidence: 99%

“…(ii) Case II: As is well known, with increasing temperature of the system, the rates of chemical reactions increase [118], leading to higher removal rates [116,119,120]. Kim et al reported that the slurries at higher temperatures lead to the formation of the soft layers on the surface of SiO 2 film, and this layer could be easily removed by mechanical abrasion [116,119]. Mudhivarthi et al found that an increase in the surface oxidation/dissolution rate of Cu film, resulting in higher Cu removal rates [120].…”

Section: The Effect Of Temperature Changes On the Chemical And Mechanical Reactions During Polishingmentioning

confidence: 99%

A review on chemical and mechanical phenomena at the wafer interface during chemical mechanical planarization

Seo

2021

Journal of Materials Research

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As the minimum feature size of integrated circuit elements has shrunk below 7 nm, chemical mechanical planarization (CMP) technology has grown by leaps and bounds over the past several decades. There has been a growing interest in understanding the fundamental science and technology of CMP, which has continued to lag behind advances in technology. This review paper provides a comprehensive overview of various chemical and mechanical phenomena such as contact mechanics, lubrication models, chemical reaction that occur between slurry components and films being polished, electrochemical reactions, adsorption behavior and mechanism, temperature effects, and the complex interactions occurring at the wafer interface during polishing. It also provides important insights into new strategies and novel concepts for next‐generation CMP slurries. Finally, the challenges and future research directions related to the chemical and mechanical process and slurry chemistry are highlighted.

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“…10, 11 Most of these studies focused on the global temperature rise of the polishing system. 7,8,11,12 Kim et al 11 and Horng et al 8 showed a linear temperature rise with increase in rotation rate. In a few studies, the radial lap temperature profile was measured where the temperature maximum was located at the maximum workpiece radial contact with the lap.…”

Section: Introductionmentioning

confidence: 97%

“…A number of models that describe the temperature rise have been proposed using kinematics, energy generation, asperity micro contact, and those accounting for frictional heating plus enhanced chemical reactivity . Most of these studies focused on the global temperature rise of the polishing system . Kim et al .…”

Section: Introductionmentioning

confidence: 99%

Influence of Temperature and Material Deposit on Material Removal Uniformity during Optical Pad Polishing

2014

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The effects of temperature and material deposit on workpiece material removal spatial uniformity during optical pad polishing are described. Round and square‐fused silica workpieces (25–265 mm in size) were polished on a polyurethane pad using ceria slurry under various conditions. Using a nonrotated workpiece on a rotating lap, elevated temperatures (as measured by IR imaging), due to frictional heating at the workpiece–lap interface, were observed having a largely radial symmetric profile (relative to the lap center) on both the workpiece and lap with a peak temperature corresponding to the workpiece center. A 3D steady‐state thermal model of the polishing process, which accounts for the frictional heating and effective heat transfer from various surfaces, quantitatively describes the observed thermal profiles. The temperature spatial uniformity, which affects the material removal spatial uniformity, can be significantly improved using a rotated workpiece and a specially designed compensating septum during polishing. Next, using a rotating workpiece and lap, the workpiece surface develops two types of mid‐range structure: (1) fine ripples (sub‐mm scale length) that run circumferentially with respect to the lap, which have been attributed to microscopic islands of slurry on the lap leading to radial material removal nonuniformities; and (2) a center depression (cm scale length) which has been attributed to nonlinear slurry & glass products buildup at a specific radial lap location. A polishing simulator model (called Surface Figure or SurF), which accounts for workpiece wear, pad wear, and now deposition on the pad, correctly simulates the preferential material deposit on the pad and the center depression structure developed on the workpiece. Strategies, such as time averaging through kinematics and diamond conditioning, for preventing both these nonuniformities are demonstrated.

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Improvement of TEOS-chemical mechanical polishing performance by control of slurry temperature

Cited by 17 publications

References 25 publications

A study of morphological properties of SiO2 aerogels obtained at different temperatures

A study of morphological properties of SiO2 aerogels obtained at different temperatures

A review on chemical and mechanical phenomena at the wafer interface during chemical mechanical planarization

Influence of Temperature and Material Deposit on Material Removal Uniformity during Optical Pad Polishing

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