Improvement of the quality by the cold plasma on the sunn pest (Eurygaster Integriceps)-damaged wheat flour

Abstract

This study aimed to improve the quality of wheat flour affected by sunn bugs (Eurygaster integriceps) by examining the effects of cold plasma on its physicochemical and dough rheological properties. The sun-damaged wheat flour was treated with Surface Dielectric Barrier Discharge using atmospheric air cold plasma at different application times. The results demonstrated that modified sedimentation volumes increased with longer plasma treatment times and maximized in 60 s without causing sunn pest-damage. The alveograph tenacity (P) increased with plasma application, and as a result, the energy (W) reached approximately three times that of the application of 60 s. The results showed that cold plasma has a big potential for improving sunn pest-damage flour (SPDF) and dough properties. The plasma application caused this positive effect on dough properties at ≤ 60.0 s.