2018 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-A 2018
DOI: 10.1109/imws-amp.2018.8457162
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Improving Conductivity of 3D Printed Conductive Pastes for RF & High Performance Electronics

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Cited by 5 publications
(2 citation statements)
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“…Though there are some examples where IPL/photonic sintering can enable processing of high-temperature inks on thermally sensitive substrates such as PET, there are many examples where the elevated temperatures produced can still negatively affect the underlying substrate, causing it to buckle, 47 deform, 42,47 and melt. 42,48 To address these challenges, Wagner et al demonstrated that the incorporation of an interfacial layer of BNNT between a silver MOD ink and PET substrate has several benefits that enhance the electrical properties of silver traces produced by IPL sintering.…”
Section: Processing Of Printed Mod Inkmentioning
confidence: 99%
“…Though there are some examples where IPL/photonic sintering can enable processing of high-temperature inks on thermally sensitive substrates such as PET, there are many examples where the elevated temperatures produced can still negatively affect the underlying substrate, causing it to buckle, 47 deform, 42,47 and melt. 42,48 To address these challenges, Wagner et al demonstrated that the incorporation of an interfacial layer of BNNT between a silver MOD ink and PET substrate has several benefits that enhance the electrical properties of silver traces produced by IPL sintering.…”
Section: Processing Of Printed Mod Inkmentioning
confidence: 99%
“…Angel et al [60] proposed a new curing method for parts printed on a uniaxial double sloped 3D surface by photonic sintering. Hawasli et al [61] also demonstrated that the resistances of 3D printed traces can be lowered by using a combination of photonic sintering and copper electroplating.…”
Section: Manufacturing Processmentioning
confidence: 99%