Abstract:a b s t r a c tGlass is a promising substitute substrate material being evaluated for electronic packaging technology. Improving the electroless copper plated layer adhesion of the glass is one of the most important considerations for development of the technology. An excimer laser (248 nm) was used for structured texturing of glass surfaces (to improve adhesion) by changing mask dimensions, laser operating parameters and overlapping pitch spacing, and therefore producing a range of micro-scale features. Elect… Show more
“…The character of the energy density is cyclic and inhomogeneous across the beam profile resulting in a departure of the Sq value from the linear relationship. Figure 33 Relationship between (a) energy density and Sq, (b) shots per area and Sq, and (c) repetition rate and Sq [231]. [Elsevier License Number – 5365280963394].…”
Section: Adhesion Improvement Using Mechanical Processesmentioning
confidence: 99%
“…Relationship between (a) energy density and Sq, (b) shots per area and Sq, and (c) repetition rate and Sq [231]. [Elsevier License Number – 5365280963394].…”
Section: Adhesion Improvement Using Mechanical Processesmentioning
This article reviews the state-of-the-art electroless copper deposition on glass substrates and the associated challenges.The well-known issue of poor adhesion of electroless copper with the glass substrate was addressed and later, improved bymodifying the surface energy using a specific chemical treatment or by creating localized surface roughening. Localized surfaceregions in the glass were created by abrasive-based ultrasonic machining and hightemperature electrochemical-discharge machiningtechniques. The effect of critical process parameters on the surface roughness and morphology was explained. Both qualitative andquantitative adhesion measurement techniques, such as cross-hatch tests and 90°/180°p eel adhesion tests, were presented. Theadhesion strength is affected by the surface roughness of the substrate and residual stress build-up in the film. As the build-up stresscan be released by the post-deposition annealing, the adhesion strength is further increased. Finally, the electroless coppertechnology in making through-glass-vias and embedded redistribution lines are presented.
“…The character of the energy density is cyclic and inhomogeneous across the beam profile resulting in a departure of the Sq value from the linear relationship. Figure 33 Relationship between (a) energy density and Sq, (b) shots per area and Sq, and (c) repetition rate and Sq [231]. [Elsevier License Number – 5365280963394].…”
Section: Adhesion Improvement Using Mechanical Processesmentioning
confidence: 99%
“…Relationship between (a) energy density and Sq, (b) shots per area and Sq, and (c) repetition rate and Sq [231]. [Elsevier License Number – 5365280963394].…”
Section: Adhesion Improvement Using Mechanical Processesmentioning
This article reviews the state-of-the-art electroless copper deposition on glass substrates and the associated challenges.The well-known issue of poor adhesion of electroless copper with the glass substrate was addressed and later, improved bymodifying the surface energy using a specific chemical treatment or by creating localized surface roughening. Localized surfaceregions in the glass were created by abrasive-based ultrasonic machining and hightemperature electrochemical-discharge machiningtechniques. The effect of critical process parameters on the surface roughness and morphology was explained. Both qualitative andquantitative adhesion measurement techniques, such as cross-hatch tests and 90°/180°p eel adhesion tests, were presented. Theadhesion strength is affected by the surface roughness of the substrate and residual stress build-up in the film. As the build-up stresscan be released by the post-deposition annealing, the adhesion strength is further increased. Finally, the electroless coppertechnology in making through-glass-vias and embedded redistribution lines are presented.
“…B. He et al found the relationships between the critical load and 3D roughness parameters Spc , Sq , Vvc , Sdq in the micro-connected structure, and gave application range of Spc , Sq , Vvc , Sdq [ 19 ]. Zeng et al combined the surface height probability density function, autocorrelation function and height parameters to evaluate the correlation of 2D and 3D roughness parameters to surface bearing capacity, friction and lubrication performance [ 20 ].…”
Among the 26 roughness parameters described in ISO 25178 standard, the parameters used to characterize surface performance in characterization parameter set (CPS) lack scientificity and unity, resulting in application confusion. The current CPS comes from empirical selection or small sample experiments, thus featuring low generality. A new method for constructing CPS in rough surfaces is proposed to solve the above issues. Based on a data mining method, statistical theory, and roughness parameters definitions, the 26 roughness parameters are divided into CPS and redundant parameter sets (RPS) with the help of reconstructed surfaces and machining experiments, and the mapping relationships between CPS and RPS are established. The research shows that RPS accounts for 50%, and CPS, of great significance for surface performance, and has the ability to fully cover surface topography information. The birth of CPS provides an accurate parameter set for the subsequent study of different surface performance, and it provides more effective parameters for evaluating the workpiece surface performance from the same batch.
“…In slightly more recent times, other science areas have caught up with the existence of areal parameters and their potential to help understand adhesion, with a range of S parameters being in the biomedical sciences used to measure the adhesion and proliferation of fibroblasts and bacterial strains [18] as well as soft tissue attachment to titanium abutments (noting that this work also considered profile parameters) [19]. In addition to being explored within civil engineering applications -again attempting to correlate surface topography to adhesion or concrete and epoxy layers [20]- [22] as well as steel-epoxy adhesion interfaces [23], and initial work on the bond strength of copper/glass [24].…”
Glass as an alternative printed circuit board material and interposer has been investigated for use in the micro-electronics industry. Electroless copper plating is used to provide the conductive layer, but there is limited understanding of how the surface topography of the glass substrate affects the copper/glass bonding strength exhibited in the current literature. A laser ablation technique was used to prepare glass surfaces with micro-scale structured features in this study, and these features were characterized quantitatively using areal surface texture parameters. The copper/glass bonding adhesion strength was quantified using a scratch testing technique, and the relationships between the critical loads measured and the areal surface parameters, as well as discussion of the underlying mechanisms, are presented in this report. Statistical analysis was employed to identify the most relevant areal parameters that may be used for prediction of the copper/glass bonding strength and for design of adhesion promoting surface textures. The experimental results suggest that the most significant areal surface texture parameters to consider are Sq, Sdq, Sdr, Sxp, Vv, Vmc, and Vvc, and the recommended value range for each parameter for optimal plating adhesion performance is given.
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