Improving tensile strength of SnAgCu/Cu solder joint through multi-elements alloying

Zhu, Tangkui; Zhang, Qingke; Bai, Hailong; Zhao, Lingyan; Jin, Yan

doi:10.1016/j.mtcomm.2021.102768

Cited by 11 publications

(2 citation statements)

References 27 publications

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“…It also brings the problems of melting properties and strength reduction [ 27 , 28 ]. Hammad et al found that granular Ag 3 Sn at the solder joint improved the mechanical strength of the solder and lamellar Ag 3 Sn had poor plastic deformation [ 29 , 30 ]. Sn–Ag solder with trace additive Zn formed Sn–Ag–Zn solder with low tin cost, environmental friendliness and good wettability.…”

Section: Introductionmentioning

confidence: 99%

Interfacial reaction of Sn-1.5Ag-2.0Zn low-silver lead-free solder with oriented copper

Xiao,

Cheng,

Fu-kang

2024

Heliyon

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Section: Introductionmentioning

confidence: 99%

Interfacial reaction of Sn-1.5Ag-2.0Zn low-silver lead-free solder with oriented copper

Xiao,

Cheng,

Fu-kang

2024

Heliyon

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“…Currently, environmentally benign Pb-free solders (such as SAC305) are widely used [ 6 , 7 ]. However, compared with the Sn–Pb solder, the wettability and spread ability of the Pb-free solder are poor; therefore, the pores and microcracks in the solder joints are more severe [ 8 , 9 ]. Although many technologies can be taken to minimize them, such defects are still inevitable [ 6 , 10 , 11 ].…”

Section: Introductionmentioning

confidence: 99%

Study on the Influence of Defects on Fracture Mechanical Behavior of Cu/SAC305/Cu Solder Joint

Wang

Duan

et al. 2022

Materials

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The fracture behavior of the Cu/Sn-3.0Ag-0.5Sn (SAC305)/Cu solder joint was investigated by conducting tensile tests with in situ X-ray micro-computed tomography (μ-CT) observation, and finite element (FE) simulation. The tensile fracture process of solder joints with a real internal defect structure was simulated and compared with the experimental results in terms of defect distribution and fracture path. Additionally, the stress distribution around the defects during the tensile process was calculated. The experimental results reveal that the pores near the intermetallic compound (IMC) layers and the flaky cracks inside the solder significantly affected the crack path. The aggregation degree of the spherical pores and the angle between the crack surface and the loading direction controlled the initiation position and propagation path of the cracks. The fracture morphology indicates that the fracture of the IMC layer was brittle, while the solder fracture exhibited ductile tearing. There are significant differences in the fracture morphology under tensile and shear loading.

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Microstructures and shear strengths of W-ball solder joints aged under isothermal and cyclic thermal conditions

Wang

Zhao

et al. 2023

J Mater Sci: Mater Electron

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Improving tensile strength of SnAgCu/Cu solder joint through multi-elements alloying

Cited by 11 publications

References 27 publications

Interfacial reaction of Sn-1.5Ag-2.0Zn low-silver lead-free solder with oriented copper

Interfacial reaction of Sn-1.5Ag-2.0Zn low-silver lead-free solder with oriented copper

Study on the Influence of Defects on Fracture Mechanical Behavior of Cu/SAC305/Cu Solder Joint

Microstructures and shear strengths of W-ball solder joints aged under isothermal and cyclic thermal conditions

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